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(949) 407-8904
Mon - Fri 08:00 - 17:00
23661 Birtcher Dr., Lake Forest, California, USA
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Home
Product
Sputtering Target
By Target Materials
By Material Names A – Z
By Chemical Elements
Evaporation Materials
By Evaporation Materials
By Material Names A – Z
By Chemical Elements
Precious Metal
Precious Metal Crucible
Precious Metal Wire
Precious Metal Sputtering Target
Precious Metal Evaporation Materials
Bonding Service
Indium Target Bonding Service
OFHC Copper Backing Plates
Elastomeric Target Bonding Service
Reclaim Service
Rotatory Targets
Planar Targets
Evaporation Sources
Thermal sources
E-Beam Source Used Crucibles
3D Printing Powder
Crystal Substrates
Thermal Spraying Coating
Application
Architectural, Automotive Glass & WEB Coating
Semiconductor Materials
Hardware & Decorative Coatings
Optics Coatings
Solar
Electronics
FAQ
About Us
NEWS
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MSDS19
Material Safety Data Sheets (MSDS) – Page 19
Sputtering Target
Formula
CAS Number
Available Purities
MSDS File
Tungsten Sulfide
WS2
12138-09-9
>99.5%
Zinc Sulfide
ZnS
1314-98-3
99.9%, 99.95%, 99.99%
Aluminum Boride
AlB2
12041-50-8
99.5%
Cerium Boride
CeB6
12008-02-5
>99.9%
Chromium Boride
CrB2
12007-16-8
99.9%
Hafnium Boride
HfB2
12007-23-7
99.5%
Iron Boride
FeB
12006-84-7
99.5%
Lanthanum Boride
LaB6
12008-21-8
99.9%
Magnesium Boride
MgB2
12007-25-9
99.9%
Molybdenum Boride
Mo2B5
12007-97-5
>99.5%
Nickel Boride
Ni2B
12007-01-1
>99.5%
Tantalum Boride
TaB2
12007-35-1
99.5%
Titanium Boride
TiB2
12045-63-5
99.5%
Zirconium Boride
ZrB2
12045-64-6
99.5%
Bismuth Selenide
Bi2Se3
12068-69-8
99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Cadmium Selenide
CdSe
1306-24-7
99.9%, 99.95%, 99.99%, 99.995%, 99.999%
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