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(949) 407-8904
Mon - Fri 08:00 - 17:00
23661 Birtcher Dr., Lake Forest, California, USA
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Home
Product
Sputtering Target
By Target Materials
By Material Names A – Z
By Chemical Elements
Evaporation Materials
By Evaporation Materials
By Material Names A – Z
By Chemical Elements
Precious Metal
Precious Metal Crucible
Precious Metal Wire
Precious Metal Sputtering Target
Precious Metal Evaporation Materials
Bonding Service
Indium Target Bonding Service
OFHC Copper Backing Plates
Elastomeric Target Bonding Service
Reclaim Service
Rotatory Targets
Planar Targets
Evaporation Sources
Thermal sources
E-Beam Source Used Crucibles
3D Printing Powder
Crystal Substrates
Thermal Spraying Coating
Application
Architectural, Automotive Glass & WEB Coating
Semiconductor Materials
Hardware & Decorative Coatings
Optics Coatings
Solar
Electronics
FAQ
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MSDS14
Material Safety Data Sheets (MSDS) – Page 14
Sputtering Target
Formula
CAS Number
Available Purities
MSDS File
Aluminum Nitride
AlN
24304-00-5
99.5%, 99.9%
Chromium Nitride
Cr2N
12053-27-9
99.5%, 99.9%
Boron Nitride
BN
10043-11-5
>99.5%
Germanium Nitride
Ge3N4
12065-36-0
99.9%
Iron Nitride
FeN4
37245-77-5
99.9%
Hafnium Nitride
HfN
25817-87-2
>99.5%
Niobium Nitride
NbN
24621-21-4
>99.5%
Silicon Nitride
Si3N4
12033-89-5
99.5%, 99.9%
Titanium Nitride
TiN
25583-20-4
99.5%
Tantalum Nitride
TaN
12033-62-4
>99.5%
Vanadium Nitride
VN
24646-85-3
99.5%
Zinc Nitride
Zn3N2
1313-49-1
99.9%
Zirconium Nitride
ZrN
25658-42-8
99.5%
Boron Carbide
B4C
12069-32-8
99.5%
Chromium Carbide
Cr3C2
12012-35-0
99.5%
Hafnium Carbide
HfC
12069-85-1
>99.5%
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