Physical Vapor Deposition (PVD) is a thin film preparation technique that physically vaporizes the surface of a material source (solid or liquid) into gaseous atoms, molecules or partially ionized into ions under vacuum conditions. Then, a film having a specific function is deposited on the surface of the substrate by a low-pressure gas (or plasma). The main methods of physical vapor deposition include vacuum evaporation, sputtering deposition, arc plasma plating, ion plating, and etc. PVD film has fast deposition speed as well as strong adhesion, good diffraction, and wide application range.
