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(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0887 Titanium Aluminum Silicon Sputtering Target, Ti/Al/Si

Chemical Formula Ti/Al/Si
Catalog No. ST0887
CAS Number 243854-63-9
Purity 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape Discs, Plates, Column Targets, Step Targets, Custom-made

The Titanium Aluminum Silicon Sputtering Target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers high-quality Titanium Aluminum Silicon Sputtering Target at the most competitive prices.




Description

Titanium Aluminum Silicon Sputtering Target Description

Titanium Aluminum Silicon Sputtering Target is a material used in sputtering deposition processes. Sputtering is a technique used to deposit thin films of materials onto a substrate surface, commonly used in applications such as electronics, optics, and thin-film solar cells.

The TiAlSi sputtering target is made up of a combination of titanium, aluminum, and silicon. These elements provide specific properties that make them suitable for different applications. Titanium is known for its high strength, corrosion resistance, and bio-compatibility. Aluminum is highly conductive and lightweight, making it suitable for electrical and thermal applications. Silicon has excellent semiconductor properties and is commonly used in integrated circuits and solar cells.

Titanium Aluminum Silicon Sputtering Target Specifications

Compound Formula Ti/Al/Si
Appearance Silvery-gray metallic target
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Titanium Aluminum Silicon Sputtering Target Handling Notes

  1. Indium bonding is recommended for Titanium Aluminum Silicon Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
  2. This material has a low thermal conductivity, and is susceptible to thermal shock.

Titanium Aluminum Silicon Sputtering Target Application

Titanium Aluminum Silicon Sputtering Targets are used in various applications, including coating devices, optical coatings, microelectronics, and photovoltaics. The specific composition of the target can be optimized for different applications, allowing for the deposition of thin films with specific properties and characteristics.

Titanium Aluminum Silicon Sputtering Target Packaging

Our Titanium Aluminum Silicon Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.

Get Contact

SAM’s Titanium Aluminum Silicon Sputtering Targets are available in various forms, purities, and sizes. We specialize in producing high purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Get an inquiry right now.

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Titanium Aluminum Silicon Sputtering Target, Ti/Al/Si
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