Chemical Formula: WS2
Catalog Number: ST0288
CAS Number: 12138-09-9
Purity: >99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
The tungsten disulfide sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers high-quality tungsten disulfide sputter targets at the most competitive prices.
Tungsten disulfide sputtering target is a type of sulfide ceramic sputtering target composed of tungsten and sulfur.
Tungsten, also called wolfram; wolframium, is a chemical element originated from the Swedish ‘tung sten’ meaning heavy stone(W is wolfram, the old name of the tungsten mineral wolframite). It was first mentioned in 1781 and observed by T. Bergman. The isolation was later accomplished and announced by J. and F. Elhuyar. “W” is the canonical chemical symbol of tungsten. Its atomic number in the periodic table of elements is 74 with location at Period 6 and Group 6, belonging to the d-block. The relative atomic mass of tungsten is 183.84(1) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Tungsten Sputtering Target
Sulfur, also called sulphur, is a chemical element originated from Either from the Sanskrit ‘sulvere’, or the Latin ‘sulfurium’, both names for sulfur. It was early used before 2000 BC and discovered by Chinese and Indians. “S” is the canonical chemical symbol of sulfur. Its atomic number in the periodic table of elements is 16 with location at Period 3 and Group 16, belonging to the p-block. The relative atomic mass of sulfur is 32.065(5) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Sulfide Ceramic Sputtering Target
| Compound Formula | WS2 |
| Appearance | Dark Gray, Crystalline Solid |
| Melting Point | 1,250°C |
| Density | 7.5 g/cm3 |
| Bonding Method | Indium, Elastomer |
| Available Sizes | Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ Thick: 0.125″, 0.250″ |
Indium Bonding and Elastomer Bonding are recommended for the WS2 tungsten sulfide sputtering target. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.
The tungsten disulfide sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.
Our tungsten disulfide sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportati
