Chemical Formula: CuS
Catalog Number: ST0277
CAS Number: 1317-40-4
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
Copper sulfide sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers high quality CuS sputtering targets at the most competitive price.
Copper sulfide sputtering target is a type of sulfide ceramic sputtering target composed of copper and sulfur.
Copper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Copper Sputtering Target
Sulfur, also called sulphur, is a chemical element originated from Either from the Sanskrit ‘sulvere’, or the Latin ‘sulfurium’, both names for sulfur. It was early used before 2000 BC and discovered by Chinese and Indians. “S” is the canonical chemical symbol of sulfur. Its atomic number in the periodic table of elements is 16 with location at Period 3 and Group 16, belonging to the p-block. The relative atomic mass of sulfur is 32.065(5) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Sulfide Ceramic Sputtering Target
| Material Type | Copper Sulfide |
| Symbol | CuS |
| Color/Appearance | Black target |
| Melting Point | 500 °C (932 °F) |
| Density | 4.6 g/cm3 |
| Sputter | RF, RF-R |
| Type of Bond | Indium, Elastomer |
Indium bonding and Elastomer bonding are available for the copper sulfide sputtering targets. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please click here.
Our copper sulfide sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
SAM’s copper sulfide sputtering targets are available in various forms, purities, and sizes. We specialize in producing high purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Get an inquiry right now.
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