The SnAgCu Target is a sophisticated alloy designed to deliver superior performance in thin film deposition processes. Tin serves as the primary matrix, providing excellent wettability and a moderate melting point, which ensures consistent sputtering and uniform film creation. Silver enhances both electrical and thermal conductivity while boosting the mechanical strength and oxidation resistance of the resultant films. Copper adds to the alloy’s strength, hardness, and thermal fatigue resistance, making it suitable for challenging environments. This alloy features a lower melting point compared to pure metals, allowing for smooth sputtering at reduced energy levels. Additionally, the SnAgCu Target exhibits excellent adhesion properties, low surface roughness, and high purity, all of which are critical for achieving reliable, high-quality coatings in electronic and metallurgical applications.
Related Products: Tin Sputtering Target, Sn, Tin Zinc Sputtering Target, Sn/Zn, Silver Sputtering Target, Ag, Silver Sulfide (Ag2S) Sputtering Target, Copper Sputtering Target, Cu, Aluminum Copper Sputtering Target, Al/Cu
Material Composition: Sn, Ag, Cu
Purity: 99.99%
Shape: Planar Disc
Density: 9.15-9.92 g/cm³
Types and Properties:
| Type | Density | Melting Point |
|---|---|---|
| AgCuSn27-5 | 9.8 g/cm³ | 730 ~ 755°C |
| AgCuSn85-8 | 9.15 g/cm³ | 946 ~ 985°C |
| AgCuSn30-10 | 9.92 g/cm³ | 590 ~ 718°C |
| AgCuSn23-17 | 9.4 g/cm³ | 600°C |
Note: The above specifications are based on theoretical data. For customized specifications and detailed inquiries, please contact us directly.
The SnAgCu Target is extensively utilized in advanced electronics and thin film applications due to its excellent electrical, thermal, and mechanical properties. Key applications include:
Our SnAgCu Targets are packaged to ensure their integrity during transit. Depending on the size and dimensions, smaller targets are securely placed in polypropylene (PP) boxes, while larger ones are shipped in custom-built wooden crates. We prioritize customized packaging solutions and utilize appropriate cushioning materials to provide maximum protection during transportation.
Packaging Options:
Q1: What purity levels are available for SnAgCu Targets from SAM?
A1: Stanford Advanced Materials offers SnAgCu Targets with purities up to 99.99%, ensuring high-performance sputtering with minimal contamination.
Q2: Is the SnAgCu Target RoHS compliant?
A2: Yes, SnAgCu is a lead-free alloy and fully complies with RoHS and other environmental regulations.
Q3: What deposition techniques are compatible with SnAgCu Targets?
A3: SnAgCu Targets are primarily used with DC and RF magnetron sputtering systems and are suitable for both batch and inline coating systems.
| Property | SnAgCu Target | SnPb Target | Pure Sn Target |
|---|---|---|---|
| Composition | Sn-(3.0-3.8)Ag-(0.5-0.7)Cu | Sn37Pb, Sn40Pb (legacy) | Pure Sn (≥99.99%) |
| Purity | ≥99.9% | ≥99.5% (lead contamination risks) | ≥99.99% |
| Melting Point | 217-220°C | 183°C (eutectic SnPb) | 232°C |
| Electrical Conductivity | Moderate (Ag/Cu enhances conductivity) | High (Pb enhances) | Low |
| Thermal Conductivity | 60-80 W/m·K | 50 W/m·K | 67 W/m·K |
| Thermal Stability | Good (up to 200°C) | Poor (Pb oxidizes above 200°C) | Moderate (prone to whiskers) |
| EM Resistance | Moderate | Low | Low |
| Deposition Rate | High | High | Low (pure Sn) |
| Film Uniformity | Excellent (nanoscale control) | Good (legacy systems) | Poor (uneven grain growth) |
| Wetting Performance | Good (balanced Ag/Cu ratio) | Excellent (legacy Pb benefits) | Poor |
| Cost | High (Ag content ~40-50% of cost) | Low (legacy, but banned in many regions) | Low |
| Primary Applications | Semiconductor packaging, optical coatings | Legacy electronics (phased out) | Low-cost soldering |
Physical Properties:
Chemical Properties:
Tin is a versatile post-transition metal known for its softness, malleability, and excellent corrosion resistance, especially in aqueous and acidic environments. It is widely utilized for surface coatings and alloying purposes to enhance lubrication, solderability, and reduce wear in mechanical systems. In thin films, tin contributes to improved ductility and wetting behavior.
Industrial Applications:
Physical Properties:
Chemical Properties:
Silver is a highly conductive, lustrous metal known for its exceptional electrical and thermal conductivity. It exhibits excellent reflectivity, corrosion resistance, and malleability. With a high melting point, silver is ideal for applications requiring efficient thermal and electrical transfer. Additionally, silver possesses antimicrobial properties, making it valuable in medical and healthcare applications.
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Physical Properties:
Chemical Properties:
Copper is a reddish-gold metal prized for its outstanding electrical and thermal conductivity, second only to silver. It boasts high ductility, excellent malleability, and robust resistance to corrosion in diverse environments. Copper is a critical material in electronics, electrical wiring, and metallization processes, often alloyed to enhance mechanical strength without significantly compromising conductivity.
Industrial Applications:
