Material | Ta, W |
Purity | 99.95% |
Shape | Planar Disc |
The TaW Target is a robust composite sputtering material that merges the outstanding corrosion resistance of tantalum with the high melting point and excellent thermal conductivity of tungsten. This alloy offers remarkable mechanical strength and stability, making it ideal for sputtering processes that operate under extreme conditions. Tantalum ensures resistance to chemical degradation, especially in acidic and high-temperature settings, while tungsten enhances the target’s ability to endure heat and mechanical stress. The synergy of these metals results in a highly durable target, ideal for demanding thin film deposition tasks. The TaW Target maintains uniformity and consistency during sputtering, ensuring high-quality film deposition with minimal particle contamination. It is widely utilized in sectors such as aerospace, electronics, and energy, where performance and longevity are paramount.
Related Products: Tantalum Sputtering Target, Ta, Tantalum Aluminum Sputtering Target, Ta/Al, Tungsten Sputtering Target, W, Nickel Tungsten Sputtering Target, Ni/W
Material Composition: Ta, W
Purity: 99.95%
Shape: Planar Disc
Please note that the specifications provided are based on theoretical data. For customized specifications and detailed inquiries, please contact us directly.
Semiconductor Fabrication: Utilized for depositing thin films in semiconductor devices, particularly for creating durable barrier layers and conductive coatings that require high corrosion resistance and thermal stability.
Aerospace and Defense: Employed in coating aerospace components such as turbine blades and engine parts, where high-temperature resistance and mechanical strength are critical.
Energy Sector: Applied in the energy industry for coating high-performance components in nuclear reactors and other extreme environments, providing excellent corrosion resistance and durability.
Optical Coatings: Used in the deposition of thin films for optical applications that demand durable and high-performance materials.
Advanced Electronics: Ideal for producing thin films in microelectronics and advanced electronic devices, offering conductive layers with superior durability and resistance to wear and high temperatures.
Our TaW Targets are carefully packaged to ensure their integrity during shipping. Depending on the size and dimensions, smaller targets are securely placed in polypropylene (PP) boxes, while larger ones are shipped in custom-built wooden crates. We prioritize customized packaging solutions and use appropriate cushioning materials to provide maximum protection during transit.
Packaging Options:
Q1: What are the primary advantages of using TaW targets?
A1: TaW targets offer exceptional high-temperature stability, excellent corrosion resistance, and strong mechanical properties, making them ideal for demanding environments such as aerospace, semiconductor manufacturing, and energy applications.
Q2: Can the size or shape of the TaW target be customized?
A2: Yes, Stanford Advanced Materials provides customized TaW targets in various sizes and shapes to meet specific application requirements. Please contact us for tailored options.
Q3: Which sputtering methods are compatible with TaW targets?
A3: TaW targets are compatible with both DC and RF sputtering methods and are suitable for high-power sputtering systems, ensuring consistent and high-quality deposition for thin film applications.
Property | TaW Target | Tantalum (Ta) Target | Niobium (Nb) Target |
---|---|---|---|
Material Composition | Tantalum Tungsten Alloy | Pure Tantalum | Pure Niobium |
Applications | Thin Films, Coatings | Electronics, Alloys | Electronics, Alloys |
Melting Point | ~3,000°C | ~2,996°C | ~2,468°C |
Density (g/cm³) | 17 | 16.6 | 8.57 |
Conductivity | Low | Low | High |
Cost | High | High | Moderate |
Hardness | High | High | Moderate |
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