ST6580 Aluminum Tin Copper Target (AlSnCu Target)

Description of Aluminum Tin Copper Target (AlSnCu Target)

The AlSnCu Target is a versatile multi-element sputtering material that offers an optimal balance of lightweight properties, electrical conductivity, and mechanical flexibility. Predominantly composed of aluminum, with precise additions of tin and copper, this alloy leverages aluminum’s low density and excellent corrosion resistance. Copper enhances the material’s electrical and thermal conductivity, while tin improves lubricity, processability, and resistance to wear and galling.

This target boasts a homogeneous microstructure, achieved through advanced alloying and casting techniques, ensuring stable sputtering behavior and consistent film composition. It features a moderate melting point and thermal expansion that is compatible with a wide range of substrates, making it suitable for controlled temperature environments. The combination of aluminum, tin, and copper results in a material with low internal stress, strong bonding characteristics, and a stable surface morphology, ensuring dependable performance during extended sputtering operations.

Related Products: Aluminum Sputtering Target, Al, Aluminum Copper Sputtering Target, Al/Cu, Tin Sputtering Target, Sn, Tin Zinc Sputtering Target, Sn/Zn, Copper Sputtering Target, Cu, Aluminum Copper Sputtering Target, Al/Cu

Specifications of Aluminum Tin Copper Target (AlSnCu Target)

Chemical Composition: Al, Sn, Cu
Purity: 99.9%
Shape: Planar Disc

Note: Specifications are based on theoretical data. For customized requirements and detailed information, please contact us.

Size

• Thickness: 3 mm ± 0.5 mm (customizable)
• Diameter: 50 mm ± 1 mm (customizable)

Applications of Aluminum Tin Copper Target (AlSnCu Target)

• Semiconductor Interconnects: Utilized for depositing conductive layers with enhanced adhesion and reliability in microelectronic devices. Aluminum reduces weight, copper boosts conductivity, and tin enhances solderability.

• Display Technologies: Applied in thin-film transistors (TFTs) and interconnects for LCDs and OLEDs, providing excellent patterning characteristics and uniform surface coatings.

• Flexible Electronics: Ideal for wearable or bendable electronic circuits due to its ductility and strong bonding with polymer substrates.

• Printed Circuit Boards (PCBs): Used in sputtering processes for metallization layers in high-density PCBs, offering robust mechanical bonding and effective thermal management.

• Automotive Electronics: Perfect for sensor modules and control units operating in harsh environments, where oxidation resistance and thermal cycling stability are essential.

• Energy Storage Devices: Employed in advanced battery and capacitor technologies for current collectors or electrode films that require low mass and high conductivity.

Packaging of Aluminum Tin Copper Target (AlSnCu Target)

Our AlSnCu Targets are packaged according to their size and dimensions to ensure safe transportation. Smaller targets are securely enclosed in polypropylene (PP) boxes, while larger ones are shipped in custom wooden crates. We prioritize customized packaging solutions and utilize appropriate cushioning materials to provide maximum protection during transit.

Packaging Options:

• Carton
• Wooden Box
• Customized Packaging

Manufacturing Process

Overview of Manufacturing Process

Testing Methods

1. Chemical Composition Analysis: Verified using techniques such as Glow Discharge Mass Spectrometry (GDMS) or X-Ray Fluorescence (XRF) to ensure compliance with purity standards.
2. Mechanical Properties Testing: Includes tensile strength, yield strength, and elongation tests to evaluate material performance.
3. Dimensional Inspection: Measures thickness, width, and length to ensure compliance with specified tolerances.
4. Surface Quality Inspection: Identifies defects like scratches, cracks, or inclusions through visual and ultrasonic examinations.
5. Hardness Testing: Assesses material hardness to confirm uniformity and mechanical reliability.

FAQs about Aluminum Tin Copper Target (AlSnCu Target)

Q1: What purity levels are available?
A1: SAM offers AlSnCu targets with purities of ≥99.99%, suitable for high-precision thin film deposition applications.

Q2: Can this target be used with both DC and RF sputtering systems?
A2: Yes, AlSnCu targets are compatible with both DC and RF sputtering processes, depending on your specific equipment and film requirements.

Q3: What sputtering conditions are recommended?
A3: Typical working gases include high-purity argon. Sputtering power, pressure, and temperature settings should be optimized based on the chamber design and target size.

Performance Comparison: AlSnCu Target vs. Cu Target vs. AlSi Target

Related Information

Raw Materials – Aluminum

Physical Properties:

• Density: 2.7 g/cm³
• Melting Point: ~660°C
• Structure: Face-centered cubic (FCC)
• Magnetic: Non-magnetic

Chemical Properties:

• Forms a natural oxide layer that protects against further oxidation
• Exhibits excellent thermal and electrical conductivity
• Highly ductile and easily alloyed with other metals

Industrial Applications:

• Structural Components: Widely used in aerospace, automotive, and construction for its lightweight and strength.
• Electrical Applications: Essential in electrical wiring and heat exchangers due to its high conductivity.
• Thin Film Technologies: Provides a lightweight and corrosion-resistant base for various sputtering applications.

Raw Materials – Tin

Physical Properties:

• Density: 7.31 g/cm³
• Melting Point: 231.9°C
• Structure: Metallic, with a grayish appearance
• Electrical: Good conductor

Chemical Properties:

• Highly resistant to corrosion, especially from water and acidic environments
• Forms strong bonds with other metals, enhancing alloy properties
• Exhibits excellent lubricity and solderability

Industrial Applications:

• Surface Coatings: Used in coatings to prevent corrosion and improve lubrication.
• Alloying Agent: Enhances the mechanical properties of metals, improving strength and durability.
• Thin Films: Contributes to improved ductility and wetting behavior in sputtered films.

Raw Materials – Copper

Physical Properties:

• Density: ~8.96 g/cm³
• Melting Point: ~1,085°C
• Structure: Face-centered cubic (FCC)
• Electrical: Excellent conductor

Chemical Properties:

• Highly resistant to corrosion in various environments
• Easily alloyed with other metals to enhance mechanical properties without significantly reducing conductivity
• Forms a natural patina that protects against further oxidation

Industrial Applications:

• Electrical Wiring: Predominantly used for electrical conductors due to its superior conductivity.
• Thermal Management: Utilized in heat sinks and exchangers for efficient heat dissipation.
• Metallization Processes: Essential in creating conductive layers in electronics and thin film technologies.