ST6574 Nickel Copper Titanium Planar Target (NiCuTi Planar Target)

Description of Nickel Copper Titanium Planar Target (NiCuTi Planar Target)

The Nickel Copper Titanium (NiCuTi) Planar Target is a high-efficiency ternary alloy sputtering material meticulously engineered through accurate composition management. This customized blend takes advantage of each element’s unique properties, resulting in a harmonious mix of electrical conductivity, mechanical durability, corrosion resistance, and thermal stability. Nickel enhances high-temperature resistance and prevents copper diffusion, while copper provides superior electrical conductivity (8-12 μΩ·cm) and excellent thermal performance (60-90 W/m·K). Titanium contributes to a lower density (7.2-8.5 g/cm³), increased mechanical strength, and surface passivation.

Manufactured using vacuum arc remelting (VAR) and hot isostatic pressing (HIP), the target features a fine grain structure (≤15 µm) and minimal porosity (<0.2%), complemented by a polished surface (Ra <0.8 µm) to ensure consistent film deposition. The material remains stable at high temperatures (melting point 1200-1350°C) and has a thermal expansion coefficient (12-15 µm/m·K) that aligns well with substrates like silicon and glass. With a hardness ranging from 180-250 HV and a tensile strength of ≥600 MPa, the NiCuTi Target offers a balance between wear resistance and machinability. It also exhibits strong resistance to acid/base corrosion and sulfidation, thanks to a protective TiO₂ layer, and possesses antimicrobial and biocompatible properties suitable for medical coatings. Compatible with both DC and RF sputtering systems (recommended power: 150-400 W), it is ideal for reactive sputtering environments requiring customized film characteristics. The NiCuTi Target stands out by integrating conductivity, corrosion resistance, and lightweight design, making it perfect for advanced uses in semiconductors, aerospace, biomedical applications, and wear-resistant coatings, though its complex alloying and production processes may lead to higher costs and fabrication challenges.

Related Products: Nickel Sputtering Target, Ni, Nickel Cobalt Sputtering Target, Ni-Co, Copper Sputtering Target, Cu, Titanium Sputtering Target, Ti, Titanium Dioxide Sputtering Target, TiO2

Specifications of Nickel Copper Titanium Planar Target (NiCuTi Planar Target)

• Chemical Composition: Ni, Cu, Ti
• Purity Levels: 99.95%, 99.99%
• Form: Planar
• Dimensions: 376.3 x 120 x 10 mm (custom sizes available)

Note: The specifications provided are based on theoretical data. For tailored requirements and detailed inquiries, please reach out to us.

Applications of Nickel Copper Titanium Planar Target (NiCuTi Planar Target)

• Semiconductors & Electronics: Ideal for depositing high-conductivity interconnects or diffusion barrier layers (e.g., DRAM, logic chips) by utilizing copper’s conductivity and titanium’s adhesion properties.
• Optics & Displays: Serves as a foundational material for transparent conductive oxides (TCO), enhancing ITO film performance with copper’s conductivity and titanium’s resistance to oxidation.
• Aerospace Coatings: Provides protective coatings for engine components, merging titanium’s lightweight nature with nickel’s resilience at high temperatures.
• Biomedical Implants: Used for functional coatings on orthopedic and dental implants, leveraging titanium’s biocompatibility and the antimicrobial properties of nickel-copper alloys.
• Industrial Wear-Resistant Tools: Offers robust coatings for cutting tools or molds, extending their service life through the deposition of high-hardness alloys.

Packaging of Nickel Copper Titanium Planar Target (NiCuTi Planar Target)

Our NiCuTi Planar Targets are packaged in specially designed cartons tailored to the size of the material. Smaller targets are securely housed in polypropylene (PP) boxes, while larger targets are transported in custom wooden crates. We ensure precise packaging customization and use appropriate cushioning materials to provide maximum protection during shipping.

• Packaging Options: Carton, Wooden Box, or Customized.

Manufacturing Process

Brief Manufacturing Process Flow

Testing Method

1. Chemical Composition Analysis: Utilizes Glow Discharge Mass Spectrometry (GDMS) or X-Ray Fluorescence (XRF) to verify purity and control impurity levels.
2. Mechanical Properties Testing: Assesses tensile strength, yield strength, and elongation to evaluate material performance.
3. Dimensional Inspection: Ensures thickness, width, and length meet specified tolerances.
4. Surface Quality Inspection: Detects defects such as scratches, cracks, or inclusions through visual and ultrasonic examinations.
5. Hardness Testing: Measures material hardness to confirm uniformity and mechanical reliability.

FAQs for Nickel Copper Titanium Planar Target (NiCuTi Planar Target)

What is a Nickel Copper Titanium Target?

A Nickel Copper Titanium Target is a composite material utilized in sputtering deposition processes to create thin films composed of nickel, copper, and titanium alloys. It is widely employed across various industries, including electronics, automotive, and coatings, where specific alloy compositions are necessary for enhanced performance.

What are the key properties of Nickel Copper Titanium Targets?

These targets combine the strength, corrosion resistance, and thermal stability of nickel, copper, and titanium, making them ideal for producing durable and high-performance thin films with tailored electrical, mechanical, and thermal characteristics.

What are the main applications of Nickel Copper Titanium Targets?

NiCuTi Targets are extensively used in electronics, catalyst production, sensors, automotive coatings, and aerospace components. Their unique alloy composition offers superior conductivity, wear resistance, and durability in demanding environments.

Performance Comparison Table with Competing Products

Nickel Copper Titanium Target (NiCuTi Target) vs. Other Materials

Additional Information

Raw Materials – Nickel

Basic Properties

• Atomic Number: 28
• Atomic Weight: 58.69 g/mol
• Density: 8.908 g/cm³
• Melting Point: 1455°C
• Characteristics: Silvery-white, ferromagnetic at room temperature, highly malleable and ductile, and resistant to corrosion. Remains stable in air under standard conditions.
• Oxidation States: Primarily +2; occasionally +1, +3, or +4.

Chemical Properties

• Corrosion Resistance: Forms a protective nickel oxide (NiO) layer in moist air; moderately resistant to acids and bases, especially when passivated by concentrated nitric acid.
• Alloying Capability: Easily forms alloys with elements such as iron, copper, and chromium (e.g., stainless steel, Nitinol).
• Catalytic Activity: Extensively used in hydrogenation reactions, including the hardening of vegetable oils.

Applications

• Stainless Steel Production: Constitutes over 70% of global nickel consumption, enhancing corrosion resistance and mechanical strength.
• Battery Materials: Essential in nickel-metal hydride (NiMH) and lithium-ion batteries (e.g., NMC cathodes).
• Electroplating: Used for corrosion protection and decorative finishes.
• High-Temperature Alloys: Utilized in jet engines, gas turbines, and nuclear reactors for superior heat resistance.
• Catalysts: Employed in industrial hydrogenation and desulfurization processes within petrochemical refining.

Resources and Production

• Major Reserves: Indonesia (largest global reserves), Philippines, Russia.
• Mining Forms: Extracted from sulfide ores (e.g., pentlandite) and laterite (oxide) ores.
• Environmental Impact: Nickel smelting processes release sulfur oxides (SOx) and heavy metal pollutants.

Raw Materials – Copper

Atomic Properties

• Atomic Number: 29
• Atomic Weight: 63.55 g/mol
• Group: Transition metal in Group 11
• Electron Configuration: [Ar] 3d¹⁰ 4s¹

Physical Properties

• Electrical Conductivity: Approximately 5.96×10⁷ S/m at room temperature, second only to silver, making it indispensable for wiring and semiconductor interconnects.
• Thermal Conductivity: 401 W/(m·K), ideal for heat sinks and thermal management systems.
• Ductility: Can be drawn into ultra-fine wires (<0.01 mm diameter) or rolled into thin foils (<0.1 mm thickness).
• Density: 8.96 g/cm³, lighter than steel but heavier than aluminum, suitable for structural components.

Chemical Properties

• Oxidation: Develops a green patina (basic copper carbonate) in humid air, necessitating protective coatings such as nickel plating.
• Corrosion Resistance: Resistant to non-oxidizing acids (e.g., HCl) but susceptible to dissolution in nitric acid.

Key Applications

• Electronics: Integral in printed circuit boards (PCBs) and integrated circuit interconnects.
• Industrial Uses: Critical for heat exchangers and plumbing systems.
• Alloys: Forms brass (Cu-Zn), bronze (Cu-Sn), and beryllium copper (high-strength springs).

Raw Materials – Titanium

Atomic Properties

• Atomic Number: 22
• Atomic Weight: 47.87 g/mol
• Group: Transition metal in Group 4
• Electron Configuration: [Ar] 3d² 4s²

Physical Properties

• Strength-to-Weight Ratio: With a density of 4.51 g/cm³ and tensile strength up to 900 MPa (pure Ti), it is a gold standard for aerospace materials.
• High-Temperature Resistance: Melting point of 1668°C; retains strength at temperatures up to 600°C, compared to 200°C for aluminum alloys.
• Low Thermal Expansion: Coefficient of 8.6 µm/(m·K), minimizing thermal deformation.

Chemical Properties

• Passivation: Forms a protective titanium dioxide (TiO₂) layer, offering resistance to acids, bases, and seawater.
• Biocompatibility: Non-toxic and hypoallergenic, making it ideal for medical implants.

Key Applications

• Aerospace: Used in jet engine blades and airframe components.
• Medical: Essential for orthopedic implants (joint replacements) and dental fixtures.
• Chemical Industry: Utilized in corrosion-resistant reactors and desalination equipment.
• Alloys: Predominantly in Titanium-6 Aluminium-4 Vanadium (Ti-6Al-4V), which accounts for over 50% of titanium alloy usage.