ST6573 Nickel Copper Titanium Target (NiCuTi Target)

Nickel Copper Titanium Target (NiCuTi Target) Description

The Nickel Copper Titanium (NiCuTi) Sputtering Target is a meticulously crafted alloy produced through vacuum arc melting and hot isostatic pressing (HIP). Key features include:

Synergistic Alloy Characteristics

Combining nickel (melting point: 1455°C) for thermal stability and corrosion resistance, copper (thermal conductivity: 401 W/m·K) for enhanced electrical conductivity and efficient heat dissipation, and titanium (density: 4.51 g/cm³) for lightweight yet robust mechanical properties. This blend results in high hardness (Vickers hardness ≥200 HV), low resistivity (≤10 μΩ·cm), and impressive fatigue resistance.

High Purity & Consistent Structure

Achieving purity levels of ≥99.95%, with trace impurities such as Fe, C, and O maintained below 50 ppm. Advanced manufacturing processes ensure a fine-grain structure (≤15 µm), minimal porosity (<0.2%), and a smooth surface finish (Ra <0.8 µm after CMP polishing) for uniform sputtering performance.

Durability in Extreme Conditions

Titanium’s natural oxide layer (TiO₂) and nickel’s passivation contribute to stability in high-temperature (up to 800°C), acidic, or humid environments, making it suitable for long-term high-power sputtering applications.

Related Products: Nickel Sputtering Target, Ni, Nickel Cobalt Sputtering Target, Ni-Co, Copper Sputtering Target, Cu, Titanium Sputtering Target, Ti, Titanium Dioxide Sputtering Target, TiO2

Nickel Copper Titanium Target (NiCuTi Target) Specifications

• Chemical Composition: Ni, Cu, Ti
• Purity Levels: 99.95%, 99.99%
• Form: Planar Disc

Note: Specifications are based on theoretical data. For customized requirements and detailed information, please contact us.

Dimensions

• Thickness: 3 mm ± 0.5 mm (customizable)
• Diameter: 50 mm ± 1 mm (customizable)

Customization is available based on specific drawings.

Nickel Copper Titanium Target (NiCuTi Target) Applications

• Semiconductors & Electronics: Used for depositing high-conductivity interconnects or diffusion barrier layers (e.g., in DRAM and logic chips), leveraging copper’s conductivity and titanium’s adhesion properties.
• Optics & Displays: Serves as a base material for transparent conductive oxides (TCO), enhancing ITO film performance with copper’s conductivity and titanium’s oxidation resistance.
• Aerospace Coatings: Provides protective coatings for engine components, combining titanium’s lightweight characteristics with nickel’s high-temperature resilience.
• Biomedical Implants: Utilized in functional coatings for orthopedic and dental implants, taking advantage of titanium’s biocompatibility and the antimicrobial properties of nickel-copper alloys.
• Industrial Wear-Resistant Tools: Offers durable coatings for cutting tools or molds, extending their lifespan through high-hardness alloy deposition.

Nickel Copper Titanium Target (NiCuTi Target) Packaging

Our NiCuTi Targets are packaged in specially designed cartons of varying sizes based on the dimensions of the material. Smaller targets are securely contained within polypropylene (PP) boxes, while larger ones are shipped in custom wooden crates. We prioritize precise packaging customization and employ suitable cushioning materials to ensure optimal protection during transit.

• Packaging Options: Carton, Wooden Box, or Customized.

Manufacturing Process

Brief Manufacturing Process Flow

Testing Method

1. Chemical Composition Analysis: Utilizes Glow Discharge Mass Spectrometry (GDMS) or X-Ray Fluorescence (XRF) to verify purity and control impurity levels.
2. Mechanical Properties Testing: Includes assessments of tensile strength, yield strength, and elongation to evaluate material performance.
3. Dimensional Inspection: Ensures thickness, width, and length meet specified tolerances.
4. Surface Quality Inspection: Detects defects such as scratches, cracks, or inclusions through visual and ultrasonic examinations.
5. Hardness Testing: Measures material hardness to confirm uniformity and mechanical reliability.

Nickel Copper Titanium Target (NiCuTi Target) FAQs

What is a Nickel Copper Titanium Target?

A Nickel Copper Titanium Target is a composite material used in sputtering deposition processes to create thin films composed of nickel, copper, and titanium alloys. It is widely utilized across various industries, including electronics, automotive, and coatings, where specific alloy compositions are necessary for enhanced performance.

What are the key properties of Nickel Copper Titanium Targets?

These targets combine the strength, corrosion resistance, and thermal stability of nickel, copper, and titanium, making them ideal for producing durable and high-performance thin films with tailored electrical, mechanical, and thermal characteristics.

What are the main applications of Nickel Copper Titanium Targets?

NiCuTi Targets are extensively used in electronics, catalyst production, sensors, automotive coatings, and aerospace components. Their unique alloy composition offers superior conductivity, wear resistance, and durability in demanding environments.

Performance Comparison Table with Competing Products

Nickel Copper Titanium Target (NiCuTi Target) vs. Other Materials

Related Information

Raw Materials – Nickel

Basic Properties

• Atomic Number: 28
• Atomic Weight: 58.69 g/mol
• Density: 8.908 g/cm³
• Melting Point: 1455°C
• Characteristics: Silvery-white, ferromagnetic at room temperature, highly malleable and ductile, and resistant to corrosion. Remains stable in air under standard conditions.
• Oxidation States: Predominantly +2; occasionally +1, +3, or +4.

Chemical Properties

• Corrosion Resistance: Develops a protective nickel oxide (NiO) layer in moist air; moderately resistant to acids and bases, especially when passivated by concentrated nitric acid.
• Alloying Capability: Forms alloys easily with elements such as iron, copper, and chromium (e.g., stainless steel, Nitinol).
• Catalytic Activity: Extensively used in hydrogenation reactions, including the hardening of vegetable oils.

Applications

• Stainless Steel Production: Constitutes over 70% of global nickel consumption, enhancing corrosion resistance and mechanical strength.
• Battery Materials: Essential in nickel-metal hydride (NiMH) and lithium-ion batteries (e.g., NMC cathodes).
• Electroplating: Employed for corrosion protection and decorative finishes.
• High-Temperature Alloys: Utilized in jet engines, gas turbines, and nuclear reactors for superior heat resistance.
• Catalysts: Used in industrial hydrogenation and desulfurization processes within petrochemical refining.

Resources and Production

• Major Reserves: Indonesia (largest global reserves), Philippines, Russia.
• Mining Forms: Extracted from sulfide ores (e.g., pentlandite) and laterite (oxide) ores.
• Environmental Impact: Nickel smelting processes release sulfur oxides (SOx) and heavy metal pollutants.

Raw Materials – Copper

Atomic Properties

• Atomic Number: 29
• Atomic Weight: 63.55 g/mol
• Group: Transition metal in Group 11
• Electron Configuration: [Ar] 3d¹⁰ 4s¹

Physical Properties

• Electrical Conductivity: Approximately 5.96×10⁷ S/m at room temperature, second only to silver, making it indispensable for wiring and semiconductor interconnects.
• Thermal Conductivity: 401 W/(m·K), ideal for heat sinks and thermal management systems.
• Ductility: Can be drawn into ultra-fine wires (<0.01 mm diameter) or rolled into thin foils (<0.1 mm thickness).
• Density: 8.96 g/cm³, making it lighter than steel but heavier than aluminum, suitable for structural components.

Chemical Properties

• Oxidation: Develops a green patina (basic copper carbonate) in humid air, necessitating protective coatings such as nickel plating.
• Corrosion Resistance: Resistant to non-oxidizing acids (e.g., HCl) but susceptible to dissolution in nitric acid.

Key Applications

• Electronics: Integral in printed circuit boards (PCBs) and integrated circuit interconnects.
• Industrial Uses: Critical for heat exchangers and plumbing systems.
• Alloys: Forms brass (Cu-Zn), bronze (Cu-Sn), and beryllium copper (high-strength springs).

Raw Materials – Titanium

Atomic Properties

• Atomic Number: 22
• Atomic Weight: 47.87 g/mol
• Group: Transition metal in Group 4
• Electron Configuration: [Ar] 3d² 4s²

Physical Properties

• Strength-to-Weight Ratio: With a density of 4.51 g/cm³ and tensile strength up to 900 MPa (pure Ti), it is a gold standard for aerospace materials.
• High-Temperature Resistance: Melting point of 1668°C; retains strength at temperatures up to 600°C, compared to 200°C for aluminum alloys.
• Low Thermal Expansion: Coefficient of 8.6 µm/(m·K), minimizing thermal deformation.

Chemical Properties

• Passivation: Forms a protective titanium dioxide (TiO₂) layer, offering resistance to acids, bases, and seawater.
• Biocompatibility: Non-toxic and hypoallergenic, making it ideal for medical implants.

Key Applications

• Aerospace: Used in jet engine blades and airframe components.
• Medical: Essential for orthopedic implants (joint replacements) and dental fixtures.
• Chemical Industry: Utilized in corrosion-resistant reactors and desalination equipment.
• Alloys: Predominantly in Titanium-6 Aluminium-4 Vanadium (Ti-6Al-4V), which accounts for over 50% of titanium alloy usage.