ST6572 Nickel Platinum Target (NiPt Target)

Nickel Platinum Target (NiPt Target) Description

Nickel-Platinum sputtering targets (NiPt Targets) are engineered for high-performance applications by precisely alloying nickel (Ni) with platinum (Pt) in predetermined ratios (e.g., Ni:Pt = 80:20 or other customized proportions). Key attributes include:

• Exceptional Purity: Achieving metal purity levels of ≥99.95%, with critical impurities such as Fe, Cu, and C maintained below 50 ppm. Purity is confirmed using Glow Discharge Mass Spectrometry (GDMS) and X-Ray Fluorescence (XRF), minimizing contamination risks during sputtering.
• Superior Thermal Stability: With melting points reaching up to 1455°C and thermal conductivity around 90 W/(m-K), these targets perform reliably in high-power sputtering environments, mitigating issues like film cracking or delamination caused by thermal stress.
• Consistent Microstructure: Controlled by hot isostatic pressing (HIP) and powder metallurgy, the targets feature grain sizes ≤10 µm, porosity <0.1%, and surface roughness Ra <0.5 µm through chemo-mechanical polishing, ensuring uniform sputtering rates and film consistency.
• Enhanced Corrosion Resistance: The incorporation of platinum significantly boosts the alloy’s resistance to oxidation, acids, and alkalis, making it ideal for long-term applications in harsh conditions such as acidic gas environments or high-temperature oxidative settings.

Related Products: Nickel Sputtering Target, Ni, Platinum Sputtering Target, Pt, Nickel Cobalt Sputtering Target, Ni-Co, Platinum Iridium Sputtering Target, Pt-Ir

Nickel Platinum Target (NiPt Target) Specifications

• Melting Point: 1400-1650 °C
• Element Symbols: Ni, Pt
• Purity Levels: 99.9%, 99.95%
• Form: Planar Disc

Note: Specifications are based on theoretical data. For customized requirements and detailed information, please contact us.

• Size: Customizable

Nickel Platinum Target (NiPt Target) Applications

• Semiconductor Fabrication: Utilized for depositing highly conductive electrodes or interconnect layers, such as platinum-based barrier layers in DRAM and logic chips, enhancing electromigration resistance and device longevity.
• Optical Coatings: Employed as reflective layers or substrates for transparent conductive oxides (TCO) in Low-E glass and solar films, optimizing light transmission and thermal barrier properties.
• Scientific Research & High-End Instruments: Applied in X-ray mirror coatings for synchrotron radiation sources, superconducting film production for quantum devices, and functional coatings for precision sensors.
• Corrosion-Resistant Industrial Components: Provides platinum alloy protective coatings for critical parts in chemical processing equipment and marine environments, ensuring durability in corrosive conditions.

Nickel Platinum Target (NiPt Target) Packaging

Our Nickel Platinum Targets are packaged in tailored cartons of varying sizes based on material dimensions. Smaller items are securely housed in polypropylene (PP) boxes, whereas larger targets are shipped in custom wooden crates. We ensure precise packaging customization and the use of appropriate cushioning materials to guarantee optimal protection during transit.

• Packaging Options: Carton, Wooden Box, or Customized.

Manufacturing Process

Brief Manufacturing Process Flow

Testing Method

1. Chemical Composition Analysis: Utilizing GDMS or XRF to verify purity levels and impurity concentrations.
2. Mechanical Properties Testing: Assessing tensile strength, yield strength, and elongation to evaluate material performance.
3. Dimensional Inspection: Measuring thickness, width, and length to ensure compliance with specified tolerances.
4. Surface Quality Inspection: Identifying defects such as scratches, cracks, or inclusions through visual and ultrasonic methods.
5. Hardness Testing: Measuring material hardness to ensure uniformity and mechanical reliability.

Nickel Platinum Target (NiPt Target) FAQs

Q1: What are the physical characteristics of the NiPt Target?

A1: NiPt targets are dense, highly corrosion-resistant, and exhibit excellent thermal stability. They feature a fine-grain structure and smooth surfaces, ensuring uniform sputtering performance.

Q2: What deposition techniques are compatible with NiPt targets?

A2: These targets are primarily used in physical vapor deposition (PVD) methods, including direct current (DC) and radio frequency (RF) magnetron sputtering.

Q3: How should the NiPt target be stored?

A3: It is recommended to store NiPt targets in a clean, dry environment, preferably in vacuum-sealed packaging to prevent contamination and oxidation.

Performance Comparison Table with Competing Products

Nickel Platinum Target (NiPt Target) vs. Other Materials

Related Information

1. Raw Materials – Nickel

Basic Properties

• Atomic Number: 28
• Atomic Weight: 58.69 g/mol
• Density: 8.908 g/cm³
• Melting Point: 1455°C
• Characteristics: Silvery-white, ferromagnetic at room temperature, malleable, ductile, and corrosion-resistant. Remains stable in air under standard conditions.
• Oxidation States: Primarily +2; occasionally +1, +3, or +4.

Chemical Properties

• Corrosion Resistance: Forms a protective nickel oxide (NiO) layer in moist air; moderately resistant to acids and alkalis, especially when passivated by concentrated nitric acid.
• Alloying Capacity: Easily forms alloys with elements like iron, copper, and chromium (e.g., stainless steel, Nitinol).
• Catalytic Activity: Widely used in hydrogenation reactions, such as vegetable oil hardening.

Applications

• Stainless Steel Production: Accounts for over 70% of global nickel consumption, enhancing corrosion resistance and mechanical strength.
• Battery Materials: Essential component in nickel-metal hydride (NiMH) and lithium-ion batteries (e.g., NMC cathodes).
• Electroplating: Used for corrosion protection and decorative finishes.
• High-Temperature Alloys: Utilized in jet engines, gas turbines, and nuclear reactors for heat resistance.
• Catalysts: Employed in industrial hydrogenation and desulfurization processes in petrochemical refining.

Resources and Production

• Major Reserves: Indonesia (largest global reserves), Philippines, Russia.
• Mining Forms: Extracted from sulfide ores (e.g., pentlandite) and laterite (oxide) ores.
• Environmental Concerns: Nickel smelting releases sulfur oxides (SOx) and heavy metal pollutants.

2. Raw Materials – Platinum

Basic Properties

• Atomic Number: 78
• Atomic Weight: 195.08 g/mol
• Density: 21.45 g/cm³ (one of the densest metals)
• Melting Point: 1768°C
• Characteristics: Silvery-white, highly ductile, chemically inert noble metal.
• Oxidation States: Primarily +2 and +4.

Chemical Properties

• Corrosion Resistance: Resistant to most acids (except aqua regia) and oxidation; stable at high temperatures.
• Catalytic Activity: Exceptional catalyst for hydrogenation and fuel cell reactions (e.g., oxygen reduction reaction, ORR).
• Coordination Chemistry: Forms complexes like cisplatin, an anticancer drug.

Applications

• Automotive Catalytic Converters: Accounts for 40% of global demand, converting harmful exhaust gases (CO, NOx) into less toxic substances.
• Fuel Cells: Critical catalyst in proton exchange membrane fuel cells (PEMFCs) for the ORR.
• Jewelry: High-purity platinum alloys (e.g., Pt950, Pt900) used in luxury items.
• Electronics: Utilized in hard disk drives, thermocouples, and high-temperature electrodes.
• Medical Uses: Employed in anticancer drugs (cisplatin, carboplatin) and dental implants.

Resources and Production

• Major Reserves: South Africa (70% of global reserves), Russia, Zimbabwe.
• Mining Challenges: Extremely low ore grades (3-5 grams per ton) and energy-intensive refining processes.
• Strategic Importance: Referred to as “industrial vitamin” due to its scarcity and indispensable roles in advanced technologies.