CAS Number | 7440-64-4 |
Material | Yb |
Density | 6.90 g/cm3 |
Purity | 99.9% |
SAM’s Ytterbium Planar Targets are made from 99.9% to 99.99% (3N–4N) pure ytterbium metal, tailored for precision thin-film deposition. Available in standard diameters ranging from 50 to 200 mm and thicknesses from 3 to 10 mm, these targets can be bonded to Cu or Mo backing plates to enhance thermal stability. Designed with a fine-grained microstructure (<50 µm) and high density (>95% theoretical value), they minimize particle generation, ensuring film uniformity. Each target is vacuum-sealed in argon-filled packaging to prevent oxidation. SAM also provides detailed quality certifications, including ICP-MS impurity analysis and XRD crystallographic verification. For optimization, SAM offers support with sputtering parameters like RF power and gas pressure, with global shipping times of 3–4 weeks for standard orders.
Note: For specific requirements, please reach out to SAM for more detailed inquiries.
SAM ensures customized packaging for optimal protection during transportation, with options including cartons, wooden crates, or tailored packaging solutions. Small products are securely placed in PP boxes, while larger items are housed in custom wooden crates.
Q1: What is the purity of the Ytterbium Planar Target?
A1: The Ytterbium Planar Target has a purity of 99.9%.
Q2: How should Ytterbium targets be handled?
A2: Store in dry argon and avoid skin contact. Wear gloves and follow cleanroom protocols.
Q3: What sputtering parameters should be used?
A3: Typical sputtering settings include RF power of 80–200 W, argon pressure of 2–5 mTorr, and substrate temperatures between 100–300°C.
Feature | Ytterbium Rotary Target | Ytterbium Planar Target |
---|---|---|
Material Utilization | 80-90% | 30-40% |
Service Life | Longer | Shorter |
Coating Uniformity | More uniform | Thickness variations |
Production Cost | Higher initial cost, more economical long-term | Lower initial cost, more frequent changes |
Applications | Large-area coatings | Small-area coatings |
Sputtering Stability | More stable | Less stable |
Compatible Equipment | Rotary sputtering systems | Traditional planar sputtering systems |