| CAS Number | 7440-30-4 |
| Material | Tm |
| Density | 9.3208 g/cm3 |
| Purity | 99.9% |
Stanford Advanced Materials (SAM) specializes in Thulium Planar Targets fabricated from 99.9% to 99.99% (3N-4N) purity thulium metal, tailored for precision thin-film applications. These targets are available in standard diameters ranging from 50 mm to 200 mm with thicknesses of 3-10 mm and can be customized with bonded configurations (e.g., Cu or Mo backing plates) to enhance thermal stability in high-power sputtering systems. Engineered with a fine-grain structure (<50 µm) and high density (>95% theoretical value), they minimize particle ejection and ensure consistent film uniformity. Each target is vacuum-sealed in argon-filled packaging with desiccant to prevent oxidation during storage and shipping. Rigorous quality assurance, including ICP-MS impurity analysis, XRD crystallographic verification, and surface roughness testing (<0.5 µm Ra), ensures compliance with ASTM F3091 and ISO 9001 standards. SAM provides technical guidance on sputtering parameters (e.g., RF power optimization, gas pressure ranges) and guarantees rapid delivery (3-4 weeks for standard orders) to global research and industrial facilities.
| Purity | 99.9% |
| Theoretical Density | 9.3208 g/cm3 |
| Melting Point | 1545 ℃ |
| Boiling Point | 1947 ℃ |
| Product Shape | Rectangular, or customized upon request |
| Product Size | Customized |
The above product information is based on theoretical data. For specific requirements and detailed inquiries, please contact us.
Our products are packaged in customized cartons of various sizes based on the material dimensions. Small items are securely packed in PP boxes, while larger items are placed in custom wooden crates. We ensure strict adherence to packaging customization and the use of appropriate cushioning materials to provide optimal protection during transportation.
Packaging: Carton, Wooden Box, or Customized.
Q1: Can I request custom target shapes or bonding?
A1: Yes. Custom diameters, thicknesses, and bonded configurations (e.g., Ag backing plates) are supported.
Q2: How is oxidation prevented during storage?
A2: Targets are vacuum-sealed in argon-filled containers and shipped with desiccant. Storage in dry inert gas is recommended.
Q3: Do you provide technical support?
A3: Yes. SAM offers sputtering parameter optimization guides and troubleshooting for film quality issues.
| Feature | Thulium Rotary Target | Thulium Planar Target |
|---|---|---|
| Material Utilization | Up to 80-90% | Around 30-40% |
| Service Life | Longer, reducing replacement frequency | Shorter, requiring more frequent replacement |
| Coating Uniformity | More uniform, ideal for large-area coatings | May have thickness variations |
| Production Cost | Higher initial cost but more economical long term | Lower initial cost but requires more frequent changes |
| Applications | Large-area coatings (TFT-LCD, solar cells, optical coatings) | Small-area coatings (semiconductors, precision electronics) |
| Sputtering Stability | More stable, reducing material loss | Potentially less stable due to uneven erosion |
| Compatible Equipment | Requires rotary sputtering systems | Compatible with traditional planar sputtering systems |
Key Uses:
