ST0975 Copper Manganese Nickel Sputtering Target, CuMnNi

Copper Manganese Nickel Sputtering Target Description

Copper Manganese Nickel Sputtering Target is a specialized material used in the process of sputtering, which is a technique for depositing thin films onto substrates. This target is composed of a combination of manganese, nickel, and copper. During sputtering, ions are directed at the target material, causing the release of atoms or particles. These released particles then deposit onto a substrate, creating a thin film. Copper Manganese Nickel Sputtering Targets find applications in various industries, including semiconductor manufacturing, optical coatings, and thin-film technology, where the unique properties of this combination of metals are utilized for specific performance requirements.

Related Product: Manganese Sputtering Target, Manganese Oxide Sputtering Target

Copper Manganese Nickel Sputtering Target Specifications

Copper Manganese Nickel Sputtering Target Handling Notes

1. Indium bonding is recommended for the Copper Manganese Nickel Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
2. This material has a low thermal conductivity and is susceptible to thermal shock.

Copper Manganese Nickel Sputtering Target Application

1. Semiconductor Manufacturing: Due to their unique combination of alloys, Copper Manganese Nickel Sputtering Targets are used in the semiconductor industry for thin film deposition to prepare thin films for electronic components and integrated circuits.
2. Optical Coatings: These targets play a key role in the preparation of optical coatings. They are used to prepare thin films with special optical properties for a variety of optical devices and applications.
3. Magnetic Film Preparation: Due to the magnetic properties of nickel and copper, Copper Manganese Nickel Sputtering Targets are used to prepare magnetic films for a wide range of applications such as magnetic storage and sensors.
4. Electronics: In the manufacture of electronic devices, these targets are commonly used to prepare thin films to improve the performance and stability of electronic components.

Copper Manganese Nickel Sputtering Target Packaging

Our Copper Manganese Nickel Sputtering Target is carefully handled during storage and transportation to preserve the quality of our products in their original condition.

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SAM’s Copper Manganese Nickel Sputtering Target is available in various forms, purities, and sizes. We specialize in producing high-purity physical vapour deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapour deposition (CVD), and physical vapour deposition (PVD) display and optical applications.