Chemical Formula | TeO2 |
Catalog No. | ST0930 |
CAS Number | 7446-7-3 |
Purity | 99.9%, 99.95%, 99.99%, 99.995%, 99.999% |
Shape | Discs, Plates, Column Targets, Step Targets, Custom-made |
The Tellurium Dioxide Sputtering Target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) boasts extensive experience in providing Tellurium Dioxide Sputtering Targets with both high purity and competitive pricing.
Tellurium Dioxide Sputtering Target is a material used in the sputtering process for depositing thin films onto substrates. Tellurium dioxide is a compound composed of tellurium (Te) and oxygen (O) ions. In sputtering, high-energy ions are directed at the tellurium dioxide sputtering target, causing atoms or molecules to be ejected from the target surface. These ejected particles then deposit onto a substrate, forming a thin film with properties inherited from the tellurium dioxide material.
Compound Formula | TeO2 |
Molecular Weight | 209.94 |
Appearance | White target |
Melting Point (℃) | 950-1012 |
Density (g/cm3) | 5.9 |
Available Sizes | Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Our Tellurium Dioxide Sputtering Target is widely used in the production of coatings for various purposes, such as improving the wear resistance of tools, enhancing the durability of surfaces, or providing specific optical or electrical properties.
SAM’s Tellurium Dioxide Sputtering Target is available in various forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) display and optical applications.
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