Chemical Formula | LaxSr1-xCoyFe1-yO3 |
Catalog No. | ST0915 |
CAS Number | N/A |
Purity | 99.9%, 99.95%, 99.99%, 99.995%, 99.999% |
Shape | Discs, Plates, Column Targets, Step Targets, Custom-made |
The Lanthanum Strontium Cobalt Iron Oxide Sputtering Target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers Lanthanum Strontium Cobalt Iron Oxide Sputtering Targets renowned for exceptional quality, all at highly competitive prices.
Lanthanum Strontium Cobalt Iron Oxide Sputtering Target is a specialized material used in the sputter deposition process. This compound is part of the family of perovskite oxides and is known for its applications in solid oxide fuel cells (SOFCs), oxygen permeation membranes, and other related fields.
Sputtering is a technique used to deposit thin films of material onto a substrate. It involves bombarding a target material with high-energy ions, causing atoms or molecules to be ejected from the target surface. These ejected particles then deposit onto the substrate, forming a thin film.
LSCF is a mixed metal oxide that combines lanthanum, strontium, cobalt, and iron in a specific ratio. The composition is designed to optimize its electronic and ionic conductivity, making it suitable for use in SOFCs where it can function as a cathode material.
Related Product: Lanthanum Strontium Chromate Sputtering Target, Lanthanum Strontium Copper Oxide Sputtering Target
Compound Formula | LaxSr1-xCoyFe1-yO3 |
Molecular Weight | 97.63 |
Appearance | Gray Target |
Melting Point | >1000℃ |
Density | – |
Available Sizes | Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Lanthanum Strontium Cobalt Iron Oxide Sputtering Target is essential in the fabrication of materials for advanced energy and electronic devices.
Our Lanthanum Strontium Cobalt Iron Oxide Sputtering Target is carefully handled during storage and transportation to preserve the quality of our products in their original condition.
SAM’s Lanthanum Strontium Cobalt Iron Oxide Sputtering Target is available in various forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) display and optical applications.
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