| Chemical Formula | Ni/Cr/Fe |
| Catalog No. | ST0912 |
| CAS Number | N/A |
| Purity | 99.9%, 99.95%, 99.99%, 99.995%, 99.999% |
| Shape | Discs, Plates, Column Targets, Step Targets, Custom-made |
The Inconel 600 Sputtering Target is available in various forms, purities, and sizes. Stanford Advanced Materials (SAM) offers high-quality Inconel 600 Sputtering Targets at the most competitive prices.
Inconel 600 Sputtering Target is a specialized material used in the sputter deposition process to create thin films for various applications in electronics, aerospace, and other industries.
In the sputtering process, the Inconel 600 Sputtering Target is bombarded with high-energy ions, causing atoms or molecules to be ejected from the target material. These ejected particles then deposit onto a substrate, forming a thin film of Inconel 600. The resulting thin film inherits the properties of Inconel 600, such as corrosion resistance and high-temperature stability.
Related Product: Nickel Telluride Sputtering Target, Nickel Titanium Sputtering Target, Nickel Tungsten Sputtering Target
| Compound Formula | Ni/Cr/Fe |
| Molecular Weight | N/A |
| Appearance | Metallic solid |
| Melting Point (℃) | 1,395 |
| Boiling Point (℃) | N/A |
| Theoretical Density (g/cm3) | 8.5 |
| Available Sizes | Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Inconel 600 Sputtering Target is suitable for use in extreme environments, such as high-temperature and corrosive applications.
Our Inconel 600 Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.
SAM’s Inconel 600 Sputtering Targets are available in various forms, purities, and sizes. We specialize in producing high purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.
