| Chemical Formula | Co/Pt |
| Catalog No. | ST0904 |
| CAS Number | N/A |
| Purity | 99.9%, 99.95%, 99.99%, 99.995%, 99.999% |
| Shape | Discs, Plates, Column Targets, Step Targets, Custom-made |
The Cobalt Platinum Sputtering Target is available in various forms, purities, and sizes. Stanford Advanced Materials (SAM) offers high-quality Cobalt Platinum Sputtering Target at the most competitive prices.
Cobalt Platinum Sputtering Target is a specialized material used in a process known as sputter deposition. Sputtering is a thin film deposition technique where ions are used to bombard a target material, causing atoms to be ejected from the target and deposited onto a substrate to create a thin film.
Cobalt and platinum are both metals with unique characteristics that can be advantageous for certain applications. Platinum is known for its corrosion resistance and catalytic properties, while cobalt is often used in magnetic applications.
Related Product: Aluminum Cobalt Sputtering Target, Chromium Cobalt Sputtering Target
| Compound Formula | Co/Pt |
| Molecular Weight | 254.02 |
| Appearance | Metallic solid |
| Melting Point | 1680-1770℃ |
| Available Sizes | Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Cobalt Platinum Sputtering Target is widely used in the manufacturing of electronic devices, such as semiconductors, solar cells, and flat-panel displays.
Our Cobalt Platinum Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.
SAM’s Cobalt Platinum Sputtering Targets are available in various forms, purities, and sizes. We specialize in producing high purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.
