| Catalog No. | CM1370 |
|---|---|
| Purity | 99-99.95% |
| CAS Number | 7440-50-8 |
| Shape | Spherical Gas Atomized |
| Particle Size | -75 +31 µm; -90 +38 µm |
Copper Powder for Thermal Spraying
Stanford Advanced Materials (SAM) provides high-quality copper powder used for thermal spraying coatings.
The materials of thermal spraying coatings are commonly in forms of powder, wire or rod. They are heated and convert to micrometer-size particles. Then the particles are accelerated towards substrates and create a coating. The copper powder is well known for its excellent electrical and thermal conductivities. High purity copper powder for thermal spraying coatings is generally applied where good conductivity is needed.
| Purity | 99-99.95% |
| Particle Size | -75 +31 µm; -90 +38 µm |
High purity copper powder for thermal spraying coatings is generally applied in:
-Applications where good conductivity is needed, such as EMI/RFI shielding
-Paper and printing industry to resist corrosive inks
-Repairing copper-base alloy parts
Our copper powder is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
Submit your review | |
