Company Dynamic | Stanford Advanced Materials

August 9, 2018Julissa GreenBlog, Sputtering Technology0

Main factors affecting the voltage of magnetron sputtering

Target magnetic field The cathode operating voltage of magnetron sputtering decreases as the target surface magnetic field increases, and also decreases as the sputtering etch groove of the target surface deepens. The sputtering current increases as the sputter etch bath of the target surface deepens because the sputter etched surface of the target gets closer...

August 8, 2018Julissa GreenBlog, Ceramics0

An overview of Ceramics

Introduction Ceramic is the general term for pottery and porcelain. The components of the ceramic material are mainly silicon oxide, aluminum oxide, potassium oxide, sodium oxide, calcium oxide, magnesium oxide, iron oxide, titanium oxide and etc. Common ceramic raw materials are clay, quartz, potassium sodium feldspar and etc. They generally have higher hardness but poor...

August 6, 2018Julissa GreenBlog, Industrial News, Sputtering Target, Sputtering Technology0

Preparation of CIGS absorber layer

1. Preparation of Cu/In film by magnetron sputtering In order to accurately control the element ratio of Cu/In, CuIn film is prepared by the co-sputtering method. That is, the Cu/In alloy target and the In elemental target are simultaneously sputtered in the same sputtering chamber. The distribution of Cu/In content has a great influence on...

July 30, 2018Julissa GreenBlog, Sputtering Technology0

Four main molding methods for ITO (Indium Tin Oxide) targets

As is known, the ITO sputtering target is a black-gray ceramic semiconductor formed by a series of production processes after indium oxide and tin oxide powder are mixed in a certain proportion, and then sintered in a high-temperature atmosphere (1600 degrees, oxygen sintering). The ITO film was subjected to magnetron sputtering to oxidize the ITO target...

July 26, 2018Julissa GreenBlog, PVD, Sputtering Target, Sputtering Technology0

Influencing Factors of the Sputtering Deposition Rate of Magnetron Targets

Sputter deposition rate is a parameter that characterizes the film formation rate. In addition to the influencing factors such as the type and pressure of the working gas, target type and area size of the “sputter etched area”, and target surface temperature and target surface magnetic field strength, the deposition rate is also directly affected...

July 24, 2018Julissa GreenBlog, PVD0

What are the uses of PVD (Physical Vapor Deposition) coating?

PVD(Physical Vapor Deposition) coating, a physical terminology which is seemingly difficult to understand, actually is connected closely to our daily lives. Your beautiful jewelry, expensive camera and sharp knives may all use PVD coating. If you want to know more about PVD coating, just continue to read. What is PVD coating? PVD Coating, or...

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