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Magnetron sputtering is a kind of physical vapor deposition (PVD) technology. The general sputtering method can be used to prepare a plurality of materials such as metal, semiconductor, insulator, etc., and has the advantages of simple equipment, easy control, large coating area, and strong adhesion. Magnetron sputtering has been developed since the 1970s. In addition...Continue Reading

Copper plating is one of the most widely used pre-plated layers in the electroplating industry, including solder joints, lead-tin alloys, and zinc die-casting parts. Two important applications for copper plating are on TSV and LCD panels. Through Silicon Via (TSV) One developing application for copper plating technology is through-silicon via (TSV) 3D integration. The goal...Continue Reading

Since tantalum has the ability to form oxides thin film, which has a protective effect, the tantalum target is widely used as a base material for electrolytic capacitor manufacturing. This article introduces the application of tantalum sputtering targets in the field of microelectronics. Tantalum for Thermal Inkjet Print Head Application Thermal inkjet print heads can be used...Continue Reading