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The third generation of semiconductor materials are those materials with a wide bandgap (Eg≥2.3eV). They usually have high breakdown electric field, high thermal conductivity, high electron saturation rate and higher radiation resistance. That is why they are used for making high temperature, high frequency, radiation-resistant and high power devices. Typical materials are silicon carbide (SiC), gallium nitride (GaN),...Continue Reading

Thin-film deposition refers to the creation and deposition of thin-film coatings onto a substrate material. Thin-film deposition is applied in several manufacturing processes involving the production of solid-state, optoelectronic, and medical devices and products. It is also utilized to produce other essential materials, such as LED displays, semiconductor lasers, fiber lasers, optical filters, compound semiconductors,...Continue Reading

In the sputtering process, it is important to protect the sputter targets from damages, and a very good way to achieve this is by subjecting the sputter targets to bonding services. In this post, we’ll dive deeper into the meaning and importance of target bonding services, as well as the different types of target bonding...Continue Reading