Magnetron sputtering is a physical vapor deposition method that allows the deposition of various materials, including metals, oxides, ceramics and etc. by using a specially formed magnetic field applied to a diode sputtering target. The deposition rate, or the film formation rate, is an important parameter that measures the effectiveness of the magnetron sputtering machine....Continue Reading

An Overview of Magnetron Sputtering Magnetron sputtering, a physical vapor deposition (PVD) process, is a main thin film deposition method for manufacturing semiconductors, disk drives, CDs, and optical devices. Magnetron sputtering has the advantages of high speed, low temperature, and low damage. In this article, let’s take a look at the definition, working principle, and...Continue Reading

Effect of Sputtering Target Purity on Large-Area Coating Production The requirement of the target quality for sputter coating is higher than that of the traditional materials industry. When the substrate enters the high vacuum coating chamber, if the sputtering target is not pure enough, under the action of the electric field and the magnetic field,...Continue Reading

Scandium nitride (ScN) is a metal nitride semiconductor. The crystal structure of ScN is generally rock salt and non-polar. However, the first principle calculation indicates that ScN may also have a wurtzite structure and can be made into Sc-IIIA-Nitride. The IIIA nitride refers to AlN, GaN, and InN, and the structure of the nitride is...Continue Reading

Titanium dioxide (TiO2) is a hard and chemically resistant oxide of titanium. Using TiO2 sputtering target can obtain good quality titanium dioxide films, which have been widely used in various applications due to their multiple interesting properties. The first half of this passage introduces some of the properties and applications of titanium oxide film, and the latter...Continue Reading

Definition of ITO Sputtering Target The full name of ITO is indium tin oxide, a composition of indium, tin, and oxygen with different proportions. The substance of ITO and ITO sputtering target is the same, the latter of which is actually a black-gray ceramic semiconductor formed by mixing indium oxide and tin oxide powder in...Continue Reading

Almost all new sputter deposition equipment uses a powerful magnet to spiral the electrons to accelerate the ionization of the argon around the target, resulting in an increased probability of collision between the sputtering target and the argon ions, and thus the sputtering rate is increased. Generally, most metal films uses DC sputtering, while non-conductive...Continue Reading

Previously, we have introduced Four main molding methods for ITO targets, mainly about their definitions and characteristics. And today I think it necessary to talk about the advantages and disadvantages of each method, which is helpful for you to make choices between them when you want to prepare ITO targets. Hot Pressing The hot pressing...Continue Reading

How to use ZnO or Zn powder to make a large diameter sputtering target? If you want to make a sputtering target by using ZnO or Zn powder, you have to know the following points. How to make a sputtering target? There are two main ways to make a sputtering target. One is casting. The...Continue Reading