Magnetron sputtering, a physical vapor deposition (PVD) process, is the main thin film deposition method for manufacturing semiconductor, disk drive, CD and optical devices. The following are common problems in magnetron sputtering. We have listed possible causes and related solutions for your information. Here is a quick look that may save your time. Problem 1: The...Continue Reading
1. What types of coating technology can be divided into? (1) Vacuum coating (2) Electroplating (3) Chemical reaction (4) Heat treatment (5) Physical or mechanical treatment 2. What are the applications of plasma technology in surface technology? Sputter deposition: Sputtering is the use of high-speed ions to strike a solid sputter target, causing surface molecules...Continue Reading
AlxCr1-xN coatings have excellent mechanical properties and oxidation resistance and are therefore of high application value in a variety of industrial applications. In recent years, the effects of various deposition parameters (such as partial pressure, gas mixture or temperature) on the sputtering process have been studied, but there has been little research on the influence...Continue Reading
Transparent conductive films have many applications, and indium tin oxide films have received great attention in the glass manufacturing industry due to their excellent properties. However, the manufacturing process of the indium tin oxide film requires a higher temperature, which limits its application. In order to reduce this temperature, various “sintering agents” have been taken...Continue Reading
We have previously made a brief introduction of Five Sputter Coating Technologies, including unbalanced magnetron sputtering, radio frequency sputtering (RF sputtering), direct current magnetron sputtering (DC sputtering), mid-frequency alternating current magnetron sputtering (AC sputtering), and reactive magnetron sputtering. In this article, we are going to talk about direct current (DC) sputtering in detail. To begin...Continue Reading
What is PVD Coating Technology? Physical Vapor Deposition (PVD) is a thin film preparation technique that physically vaporizes the surface of a material source (solid or liquid) into gaseous atoms, molecules, or partially ionized into ions under vacuum conditions. Then, a film having a specific function is deposited on the surface of the substrate by...Continue Reading
Unbalanced magnetron sputtering Unbalanced magnetron sputtering uses an unbalanced magnetron sputtering cathode, which refers to the unequal magnetic fluxes of the inner and outer magnetic pole sections of the cathode. The effect of the unbalanced magnetic field is to trap fast-moving secondary electrons that escape from the target surface. These electrons undergo ionizing collisions with...Continue Reading
Ion Beam Sputtering Definition Ion beam sputtering (IBS), or ion beam deposition (IBD), is a thin film deposition technology that uses an ion source to deposit a sputtering target onto a substrate to produce the highest quality films with excellent precision. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control...Continue Reading
What is Sputtering Deposition? Sputtering deposition, or sputter coating, is one of the physical vapor deposition technology, whereby particles are ejected from a solid target material due to the bombardment of the target by energetic particles. It is an electronic process that deposits thin films of metals or other materials onto a variety of surfaces. Most often,...Continue Reading
