Introduction Thin-film deposition techniques play a crucial role in various industries, providing protective coatings that enhance the properties of materials. Among these methods, Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) stand out, each distinguished by their unique characteristics, including the temperature at which they operate. Temperature Difference in PVD Definition and Basic Principles PVD encompasses...Continue Reading
Introduction Thin film coatings are a critical component of various industries, from microelectronics to optics. Two prominent techniques for depositing these thin films are sputtering and thermal evaporation. Let’s compare these two technologies to understand their strengths and applications. Sputtering: Precision and Versatility Sputtering is a physical vapor deposition (PVD) technique that involves the removal...Continue Reading
Introduction Sputtering is a cornerstone of physical vapor deposition (PVD) and stands at the forefront of materials science and advanced manufacturing. This versatile technique plays a pivotal role in the deposition of thin films onto substrates with plenty of advantages and limitations. In this article, we will delve into the world of sputtering, uncovering its...Continue Reading
Introduction Sputtering is a common thin-film deposition technique used in various industries, including semiconductors, optics, and surface coatings. A sputtering target is a key component in the process, as it is responsible for generating the material to be deposited onto a substrate. It is important to ensure that the sputtering target is used at a...Continue Reading
Introduction The deposition rate is an important factor in the field of thin film deposition, as it directly affects the production efficiency and throughput of the process. In this article, we will discuss practical methods to increase the deposition rate for various deposition techniques. Hope that you can have a better understanding of the factors...Continue Reading
Introduction Purity is one of the prime performance requirements of target selection, which has been explained in our previous article. It takes countless money, time, and labor every year to separate impurities. However, do impurities always have a negative influence on sputtering? We are going to explore this question in this article with specific cases....Continue Reading
The foundation of plasma technology is a basic physical principle. When energy is applied to matter, solids become liquids, and liquids turn into gases. If yet more energy is applied, the gas is ionized and it enters the energy-rich plasma state, the fourth state of matter. Plasma is a word used to describe matter that...Continue Reading
What is PVD Coating? Physical vapor deposition (PVD) coating refers to various coating techniques in which thin layers are created on a substrate using physical techniques. Each technology has a unique set of benefits. PVD coating starts by depositing films with precise stoichiometries to achieve color PVD finishes (ratio of certain elements). Typically, a base...Continue Reading
If you’ve ever heard of thin film coatings, then you might know about Sputtering! This involves materials being ejected from a source called a “target” onto a “substrate” like a silicon wafer. By injecting a reactive gas (usually oxygen or nitrogen) into the plasma, which is normally created by an inert gas like argon (the...Continue Reading
