Introduction Gallium Arsenide (GaAs) wafers are an essential component in the production of high-performance electronic devices, and they have specific specifications that must be met to ensure their effectiveness. In this article, we will discuss the key specifications of GaAs wafers so that you can have a further understanding of this useful material. What Are...Continue Reading

Introduction Gallium Arsenide (GaAs) wafers have a variety of applications in the field of electronics, particularly in the production of high-performance electronic devices. In this article, we will explore some common applications of GaAs wafers for electronic device manufacturing and provide a better understanding of their properties and advantages. Properties of Gallium Arsenide Wafer Gallium...Continue Reading

  Introduction Gallium phosphide (GaP) is a compound semiconductor material that has gained increasing attention in the semiconductor industry. GaP wafers offer several advantages over traditional silicon wafers, including high efficiency, high-speed operation, and high power handling capabilities. In this article, we will talk about the benefits of using gallium phosphide wafers in electronic and...Continue Reading

Introduction Crucibles are widely used in metallurgy, chemical processing, and a variety of industries. Among these crucibles, graphite crucibles are useful for the smelting of non-ferrous metals and alloys with their desirable properties. Let’s have a detailed discussion about the features, competitiveness, and uses of graphite crucibles. Hope that you can have a better understanding...Continue Reading

Introduction Garnets (A3B2(SiO4)3) are a group of minerals commonly used as substrates, abrasives, and gemstones. Garnets share similar physical properties and crystal structures, yet they have disparities in chemical composition. Here, this article is going to explore the garnet family in the specific case of gadolinium gallium garnet. Hope that you can have a basic...Continue Reading

Introduction to Indium Bonding Target bonding is a significant process that joins sputtering targets and backing plates together, yet improper bonding materials would lead to poor heat release, cracking, non-uniform deposition, and even de-bonding. Therefore, it is quite essential to have a basic understanding of the functions, benefits, and types of bonding in advance. This...Continue Reading

Introduction With the development of electronic devices, people pay more and more attention to wafers, chips, semiconductors, and integrated circuits. Everyone is trying to figure out the essence of chips. Their mind is full of questions. What is a wafer? What is a chip? What about their relations? What materials do we use to make...Continue Reading

Introduction Terbium sputtering targets are made from terbium metal. They are used widely in a range of sectors such as tool coatings, optics coatings, and solar coatings. Let’s have a detailed discussion about the features, production, and applications of terbium sputtering targets. Properties Terbium sputtering targets share similar features with terbium metal. Terbium the element...Continue Reading

1.   Introduction to Sputtering Target Selection The target quality is rather significant for the coating process, and targets’ features are affected by a variety of parameters like purity, density, porosity, grain sizes, shapes, etc. The better the target quality is, the better performance we have, and the firmer the coating layers are. Here we will...Continue Reading