Electron Beam Evaporation – Definition Electron beam evaporation, or E-beam evaporation, is a type of physical vapor deposition (PVD) technique, which directly heats the evaporation material (usually pellets) by using an electron beam under vacuum, and transports the vaporized material to the substrate to form a film. Electron Beam Evaporation – Working Processes Electron beam evaporation...Continue Reading
AlxCr1-xN coatings have excellent mechanical properties and oxidation resistance and are therefore of high application value in a variety of industrial applications. In recent years, the effects of various deposition parameters (such as partial pressure, gas mixture or temperature) on the sputtering process have been studied, but there has been little research on the influence...Continue Reading
Anelva target, I believe, is a very unfamiliar phrase for most people. And maybe that’s the reason why you are here, reading this article. Actually, with a simple explanation–Anelva target is also known as the target used in the semiconductor industry, you will immediately get its meaning. In today’s semiconductor manufacturing processes, sputtering targets are...Continue Reading
As for the two most commonly used metals for engagement and wedding rings, platinum and gold, most people distinguish them by their different colors-platinum is naturally white, and gold is naturally yellow. However, rings made of white gold (composed of gold, alloys, and a rhodium plating) have a similar white color to platinum rings. Since...Continue Reading
Tantalum Overview The texture of the tantalum is very hard and the hardness can reach 6-6.5. Its melting point is as high as 2996 °C, only after carbon, tungsten, rhenium, and osmium. Tantalum is malleable and can be drawn into a thin foil. Its coefficient of thermal expansion is very small, and it only expands by 6.6 parts...Continue Reading
We have previously made a brief introduction of Five Sputter Coating Technologies, including unbalanced magnetron sputtering, radio frequency sputtering (RF sputtering), direct current magnetron sputtering (DC sputtering), mid-frequency alternating current magnetron sputtering (AC sputtering), and reactive magnetron sputtering. In this article, we are going to talk about direct current (DC) sputtering in detail. To begin...Continue Reading
Sputtering targets have important applications in many areas, such as architecture, optics, electronics and so on. Sputtering targets used in electronic industry can be subdivided into semiconductor target (also called anelva target), planar target, coated glass target, solar photovoltaic target, and so on. There are some differences in the selection and performance requirements of sputtering materials in different application fields....Continue Reading
Sputtering targets are a physical vapor deposition (PVD) mechanism with many uses in modern technology and manufacturing. In the sputtering process, the atoms are pulled from the sputter target with powerful magnets, and a controlled gas (usually argon) is introduced. Then, the processed to collide with each other in their gaseous state before condensing into...Continue Reading
What is PVD Coating Technology? Physical Vapor Deposition (PVD) is a thin film preparation technique that physically vaporizes the surface of a material source (solid or liquid) into gaseous atoms, molecules, or partially ionized into ions under vacuum conditions. Then, a film having a specific function is deposited on the surface of the substrate by...Continue Reading
