Semiconductor wafers are the basic material for manufacturing electronic chips. The most important raw material for semiconductor integrated circuits is silicon, which is widely found in rocks and gravels in the form of silicates or silica in nature. The fabrication process of the semiconductor silicon wafer can be divided into three basic steps: silicon purification...Continue Reading
Sputtering targets are a physical vapor deposition (PVD) mechanism with many uses in modern technology and manufacturing. In the sputtering process, the atoms are pulled from the sputter target with powerful magnets, and a controlled gas (usually argon) is introduced. Then, the processed to collide with each other in their gaseous state before condensing into...Continue Reading
Due to their excellent wear resistance, heat resistance and other properties, PVD coatings are widely used in various industries. However, the defects of the coating make it impossible to demonstrate all of its advantages. If you want to solve the defects in PVD coating, you must know these defects, at least you should know – what...Continue Reading
What is PVD Coating Technology? Physical Vapor Deposition (PVD) is a thin film preparation technique that physically vaporizes the surface of a material source (solid or liquid) into gaseous atoms, molecules, or partially ionized into ions under vacuum conditions. Then, a film having a specific function is deposited on the surface of the substrate by...Continue Reading
Metal titanium and titanium sputtering target are essentially the same, both of which are composed of titanium element; the difference is that metal titanium is more like a raw material, and titanium target is more like a titanium product. Titanium as a raw material can be made into titanium sputtering targets by several methods, and...Continue Reading
Ion Beam Sputtering Definition Ion beam sputtering (IBS), or ion beam deposition (IBD), is a thin film deposition technology that uses an ion source to deposit a sputtering target onto a substrate to produce the highest quality films with excellent precision. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control...Continue Reading
What is Sputtering Deposition? Sputtering deposition, or sputter coating, is one of the physical vapor deposition technology, whereby particles are ejected from a solid target material due to the bombardment of the target by energetic particles. It is an electronic process that deposits thin films of metals or other materials onto a variety of surfaces. Most often,...Continue Reading
Magnetron sputtering is a physical vapor deposition method that allows the deposition of various materials, including metals, oxides, ceramics and etc. by using a specially formed magnetic field applied to a diode sputtering target. The deposition rate, or the film formation rate, is an important parameter that measures the effectiveness of the magnetron sputtering machine....Continue Reading
Introduction Sputtering targets are essential materials used in the deposition of thin films through a process known as sputtering, a cornerstone technique in semiconductor manufacturing and surface coating technologies. Aluminum scandium sputtering targets, consisting of an aluminum alloy with scandium, represent a significant advancement in this field. The addition of scandium to aluminum not only...Continue Reading
