Due to their excellent wear resistance, heat resistance and other properties, PVD coatings are widely used in various industries. However, the defects of the coating make it impossible to demonstrate all of its advantages. If you want to solve the defects in PVD coating, you must know these defects, at least you should know – what...Continue Reading
What is PVD Coating Technology? Physical Vapor Deposition (PVD) is a thin film preparation technique that physically vaporizes the surface of a material source (solid or liquid) into gaseous atoms, molecules, or partially ionized into ions under vacuum conditions. Then, a film having a specific function is deposited on the surface of the substrate by...Continue Reading
Unbalanced magnetron sputtering Unbalanced magnetron sputtering uses an unbalanced magnetron sputtering cathode, which refers to the unequal magnetic fluxes of the inner and outer magnetic pole sections of the cathode. The effect of the unbalanced magnetic field is to trap fast-moving secondary electrons that escape from the target surface. These electrons undergo ionizing collisions with...Continue Reading
Ion Beam Sputtering Definition Ion beam sputtering (IBS), or ion beam deposition (IBD), is a thin film deposition technology that uses an ion source to deposit a sputtering target onto a substrate to produce the highest quality films with excellent precision. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control...Continue Reading
What is Sputtering Deposition? Sputtering deposition, or sputter coating, is one of the physical vapor deposition technology, whereby particles are ejected from a solid target material due to the bombardment of the target by energetic particles. It is an electronic process that deposits thin films of metals or other materials onto a variety of surfaces. Most often,...Continue Reading
The sputtering target is an important material for physical vapor deposition, the most widely used technology for depositing materials. As its name suggests, “physical” means that the PVD coating method involves a purely physical process. During the physical vapor deposition, a solid target material is broken up into the vapor state (usually in a high...Continue Reading
Magnetron sputtering is a physical vapor deposition method that allows the deposition of various materials, including metals, oxides, ceramics and etc. by using a specially formed magnetic field applied to a diode sputtering target. The deposition rate, or the film formation rate, is an important parameter that measures the effectiveness of the magnetron sputtering machine....Continue Reading
An Overview of Magnetron Sputtering Magnetron sputtering, a physical vapor deposition (PVD) process, is a main thin film deposition method for manufacturing semiconductors, disk drives, CDs, and optical devices. Magnetron sputtering has the advantages of high speed, low temperature, and low damage. In this article, let’s take a look at the definition, working principle, and...Continue Reading
What are the Three Generations of Semiconductor Materials? The first generation of semiconductor material The first generation of semiconductor materials mainly refers to silicon (Si) and germanium (Ge) materials. In the 1950s, Ge dominated the semiconductor market and was mainly used in low-voltage, low-frequency, medium-power transistors and photodetectors. However, Ge semiconductor devices were inferior in...Continue Reading
