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Effect of Silver Additives on the Conductivity of Indium Tin Oxide Sputtered Films
Transparent conductive films have many applications, and indium tin oxide films have received great attention in the glass manufacturing industry due to their excellent properties. However, the manufacturing process of the indium tin oxide film requires a higher temperature, which limits its application. In order to reduce this temperature, various “sintering agents” have been taken...
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PVD VS. CVD
Physical vapor deposition (PVD) and chemical vapor deposition (CVD) are considered to be the most attractive surface coating technologies and have a wide range of applications in various industries. Let us compare these two methods in detail. Physical Vapor Deposition Chemical Vapor Deposition Definition PVD is a series of vacuum deposition methods that produce films...
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Sputter Coating Technologies Direct Current Sputtering
We have previously made a brief introduction of Five Sputter Coating Technologies, including unbalanced magnetron sputtering, radio frequency sputtering (RF sputtering), direct current magnetron sputtering (DC sputtering), mid-frequency alternating current magnetron sputtering (AC sputtering), and reactive magnetron sputtering. In this article, we are going to talk about direct current (DC) sputtering in detail. To begin...
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Common Defects in Physical Vapor Deposition
Due to their excellent wear resistance, heat resistance and other properties, PVD coatings are widely used in various industries. However, the defects of the coating make it impossible to demonstrate all of its advantages. If you want to solve the defects in PVD coating, you must know these defects, at least you should know – what...
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What is Physical Vapor Deposition
What is PVD Coating Technology? Physical Vapor Deposition (PVD) is a thin film preparation technique that physically vaporizes the surface of a material source (solid or liquid) into gaseous atoms, molecules, or partially ionized into ions under vacuum conditions. Then, a film having a specific function is deposited on the surface of the substrate by...
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Unbalanced magnetron sputtering Unbalanced magnetron sputtering uses an unbalanced magnetron sputtering cathode, which refers to the unequal magnetic fluxes of the inner and outer magnetic pole sections of the cathode. The effect of the unbalanced magnetic field is to trap fast-moving secondary electrons that escape from the target surface. These electrons undergo ionizing collisions with...
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advantages-and-disadvantages-of-ion-beam-sputtering
Ion Beam Sputtering Definition Ion beam sputtering (IBS), or ion beam deposition (IBD), is a thin film deposition technology that uses an ion source to deposit a sputtering target onto a substrate to produce the highest quality films with excellent precision. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control...
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an-overview-of-sputtering-deposition
What is Sputtering Deposition? Sputtering deposition, or sputter coating, is one of the physical vapor deposition technology, whereby particles are ejected from a solid target material due to the bombardment of the target by energetic particles. It is an electronic process that deposits thin films of metals or other materials onto a variety of surfaces. Most often,...
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The sputtering target is an important material for physical vapor deposition, the most widely used technology for depositing materials. As its name suggests, “physical” means that the PVD coating method involves a purely physical process. During the physical vapor deposition, a solid target material is broken up into the vapor state (usually in a high...
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