Previously, we have introduced Four main molding methods for ITO targets, mainly about their definitions and characteristics. And today I think it necessary to talk about the advantages and disadvantages of each method, which is helpful for you to make choices between them when you want to prepare ITO targets. Hot Pressing The hot pressing...Continue Reading

How to use ZnO or Zn powder to make a large diameter sputtering target? If you want to make a sputtering target by using ZnO or Zn powder, you have to know the following points. How to make a sputtering target? There are two main ways to make a sputtering target. One is casting. The...Continue Reading

Magnetron sputtering is a kind of physical vapor deposition (PVD) technology. The general sputtering method can be used to prepare a plurality of materials such as metal, semiconductor, insulator, etc., and has the advantages of simple equipment, easy control, large coating area, and strong adhesion. Magnetron sputtering has been developed since the 1970s. In addition...Continue Reading

Copper plating is one of the most widely used pre-plated layers in the electroplating industry, including solder joints, lead-tin alloys, and zinc die-casting parts. Two important applications for copper plating are on TSV and LCD panels. Through Silicon Via (TSV) One developing application for copper plating technology is through-silicon via (TSV) 3D integration. The goal...Continue Reading

Today’s article is a follow-up update of “Sputter Coating Technologies: Direct Current (DC) Sputtering“. We have already introduced DC sputtering in detail in that article, so today SAM Sputter Targets will introduce another sputter coating technology, which is called Radio Frequency (RF) sputtering. RF sputtering uses alternate current (AC) power instead of DC power to...Continue Reading

Since tantalum has the ability to form oxides thin film, which has a protective effect, the tantalum target is widely used as a base material for electrolytic capacitor manufacturing. This article introduces the application of tantalum sputtering targets in the field of microelectronics. Tantalum for Thermal Inkjet Print Head Application Thermal inkjet print heads can be used...Continue Reading

Target magnetic field The cathode operating voltage of magnetron sputtering decreases as the target surface magnetic field increases, and also decreases as the sputtering etch groove of the target surface deepens. The sputtering current increases as the sputter etch bath of the target surface deepens because the sputter etched surface of the target gets closer...Continue Reading

1. Preparation of Cu/In film by magnetron sputtering In order to accurately control the element ratio of Cu/In, CuIn film is prepared by the co-sputtering method. That is, the Cu/In alloy target and the In elemental target are simultaneously sputtered in the same sputtering chamber. The distribution of Cu/In content has a great influence on...Continue Reading

As is known, the ITO sputtering target is a black-gray ceramic semiconductor formed by a series of production processes after indium oxide and tin oxide powder are mixed in a certain proportion, and then sintered in a high-temperature atmosphere (1600 degrees, oxygen sintering). The ITO film was subjected to magnetron sputtering to oxidize the ITO target...Continue Reading