Ultra low radiation silver-coated glass production process Low-emission coated glass has now been widely accepted by the public that this kind of glass is widely used in automobiles, doors and windows, and glass curtain walls. The core functional layer for low-emission coated glass is a silver film or silver-doped alloy film layer, which bears the...Continue Reading

Effect of Sputtering Target Purity on Large-Area Coating Production The requirement of the target quality for sputter coating is higher than that of the traditional materials industry. When the substrate enters the high vacuum coating chamber, if the sputtering target is not pure enough, under the action of the electric field and the magnetic field,...Continue Reading

Scandium nitride (ScN) is a metal nitride semiconductor. The crystal structure of ScN is generally rock salt and non-polar. However, the first principle calculation indicates that ScN may also have a wurtzite structure and can be made into Sc-IIIA-Nitride. The IIIA nitride refers to AlN, GaN, and InN, and the structure of the nitride is...Continue Reading

Titanium dioxide (TiO2) is a hard and chemically resistant oxide of titanium. Using TiO2 sputtering target can obtain good quality titanium dioxide films, which have been widely used in various applications due to their multiple interesting properties. The first half of this passage introduces some of the properties and applications of titanium oxide film, and the latter...Continue Reading

Sputtering is a method of physical vapor deposition (PVD) technologies and is one of the main techniques for preparing electronic thin film materials. It utilizes the ions generated by the ion source to accelerate the aggregation in a high vacuum to form an ion beam with high speed and high energy. The ion beam bombards...Continue Reading

High-purity gold has excellent physical and chemical properties, such as low contact resistance and stability, easy bonding, and easy film formation. By adding other elements, gold can be alloyed to Gold Germanium, Gold Gallium and Gold Beryllium. The flow point of these materials can be changed, and their wettability and adhesion with different materials can...Continue Reading

Sputtering Target Maintenance In order to avoid short circuit and arc initiation caused by the unclean cavity in the sputtering process, it is necessary to remove the accumulated sputtering materials deposited in the middle and on both sides of the sputtering track in stages. It is also helpful for users to continuously sputtering with the...Continue Reading

Introduction In this article, we will explore the unique properties and applications of pyrolytic boron nitride (PBN). Also known as Chemical Vapor-Deposited Boron Nitride (CVD-BN), PBN is a remarkable material that finds use in various industries. Let’s delve into the characteristics and uses of both PBN and its related form, hexagonal boron nitride (hBN). Pyrolytic Boron Nitride...Continue Reading

Introduction Vacuum evaporation is a process in which a solid material (referred to as the evaporating material) is heated in a high vacuum environment to be deposited on a specific substrate to obtain a film. The vacuum evaporation process is mainly used in microelectronics to make active components, device contacts, and metal interconnections, high precision...Continue Reading