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Preparation It is very important to keep the vacuum chamber clean. Some residues formed during use will collect moisture and other pollutants, directly affecting the success rate of vacuum coating. Short-circuit or target arcing, film-forming surface roughness, and chemical impurities are often exceeded due to unclean sputtering chambers, sputter guns, and targets. In order to...Continue Reading

Common metal materials (such as low carbon steel, metal uranium, etc.) are very reactive and prone to corrosion and performance degradation. Therefore, people have been working on the research and preparation of anti-corrosion films for steel materials. Applying a relatively thin protective film on the surface of the metal material, such as aluminum, zinc, magnesium...Continue Reading

Introduction Ceramic is the general term for pottery and porcelain. The components of the ceramic material are mainly silicon oxide, aluminum oxide, potassium oxide, sodium oxide, calcium oxide, magnesium oxide, iron oxide, titanium oxide and etc. Common ceramic raw materials are clay, quartz, potassium sodium feldspar and etc. They generally have higher hardness but poor...Continue Reading

1. Preparation of Cu/In film by magnetron sputtering In order to accurately control the element ratio of Cu/In, CuIn film is prepared by the co-sputtering method. That is, the Cu/In alloy target and the In elemental target are simultaneously sputtered in the same sputtering chamber. The distribution of Cu/In content has a great influence on...Continue Reading

Sputter deposition rate is a parameter that characterizes the film formation rate. In addition to the influencing factors such as the type and pressure of the working gas, target type and area size of the “sputter etched area”, and target surface temperature and target surface magnetic field strength, the deposition rate is also directly affected...Continue Reading