Blog | Stanford Advanced Materials

Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials. We update every week about news and knowledge of sputtering targets and evaporation materials. Here are the blogs we published previously.

September 12, 2018Blog, Metal

Application of Titanium and Titanium Alloy in Human Implants

Speaking of titanium, many people may not know what it is, but when it comes to titanium implants, the impression of titanium in our minds suddenly becomes clearer. It has to be said that titanium and titanium alloys become well known because of their use in human implants. At present, no material is more suitable...

September 11, 2018Blog, PVD, Sputtering Technology

What are the uses of magnetron sputtering?

Magnetron sputtering is a kind of physical vapor deposition (PVD) technology. The general sputtering method can be used to prepare a plurality of materials such as metal, semiconductor, insulator, etc., and has the advantages of simple equipment, easy control, large coating area, and strong adhesion. Magnetron sputtering has been developed since the 1970s. In addition...

September 4, 2018Blog, Metal

How to get the high purity tantalum?

Tantalum belongs to the refractory metal group and is widely used as a minor component in alloys. Its chemical properties are excellent, no matter whether it is cold or hot, it does not react with hydrochloric acid, concentrated nitric acid and “Aqua regia”. Its chemical inertness and relatively low price make it a good alternative...

September 3, 2018Blog, Sputtering Technology

Applications of Copper Plating Technology on TSV and LCD Panels

Copper plating is one of the most widely used pre-plated layers in the electroplating industry, including solder joints, lead-tin alloys, and zinc die-casting parts. Two important applications for copper plating are on TSV and LCD panels. Through Silicon Via (TSV) One developing application for copper plating technology is through-silicon via (TSV) 3D integration. The goal...

August 31, 2018Blog, Sputtering Target, Sputtering Technology

Sputter Coating Technologies: Radio Frequency (RF) Sputtering

Today’s article is a follow-up update of “Sputter Coating Technologies: Direct Current (DC) Sputtering“. We have already introduced DC sputtering in detail in that article, so today SAM Sputter Targets will introduce another sputter coating technology, which is called Radio Frequency (RF) sputtering. RF sputtering uses alternate current (AC) power instead of DC power to...

August 29, 2018Blog, Sputtering Target, Sputtering Technology

Application of Tantalum Target in Thermal Inkjet Print Head and Copper Plating

Since tantalum has the ability to form oxides thin film, which has a protective effect, the tantalum target is widely used as a base material for electrolytic capacitor manufacturing. This article introduces the application of tantalum sputtering targets in the field of microelectronics. Tantalum for Thermal Inkjet Print Head Application Thermal inkjet print heads can be used...

August 23, 2018Blog, Industrial News, Sputtering Target

Do you really know what ITO film is? Click to check!

When it comes to ITO, many people first think of the International Trade Organization. If you think this article is about the International Trade Organization, then I am sorry to tell you that maybe you can stop reading now, because ITO in this passage refers to indium tin oxide. Do you think these three words...

August 21, 2018Blog, Industrial News, Sputtering Target

What is cylindrical planar sputtering target?

Common target shapes are rectangular planar targets and rotatory targets. From the name we can imagine what they look like, as shown below. The targets of these two shapes have their own advantages and disadvantages. For details, please refer to our previous news Advantages and Disadvantages of Planar target and Rotatory targets. Today, the focus...

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