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(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

Blogs

Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials. We update every week about news and knowledge of sputtering targets and evaporation materials. Here are the blogs we published previously.

Titanium Nitride Overview: Properties, Production, and Uses

Titanium nitride, also known as TiNite or TiN, is a chemical compound that is commonly used in coating objects. Titanium nitride thin film gives the coated object a gold color. It is widely used because it is less expensive than most other compounds with similar chemical properties. There are numerous commercial variants of titanium nitride, but...
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P-type & N-type Silicon Semiconductors

P-type & N-type Silicon Semiconductors

Semiconductors are critically important in our world. The most significant application is in computerized or radio waves-powered electrical devices. These semiconductors are made of the widely abundant element, silicon. In fact, silicon is at the core of almost all kinds of electronic devices. One of the reasons why they are widely used in semiconductors is...
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An Introduction to White Metals

White meals are an important category of metals used in various industrial applications, just as alloys are. An old use of white metals is their referencing in the antique trade for describing items suspected of containing silver but not hallmarked. As an example, the term “white metal” is used in the British fine art trade...
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Typical Materials of the Third Generation Semiconductors

The third generation of semiconductor materials are those materials with a wide bandgap (Eg≥2.3eV). They usually have high breakdown electric field, high thermal conductivity, high electron saturation rate and higher radiation resistance. That is why they are used for making high temperature, high frequency, radiation-resistant and high power devices. Typical materials are silicon carbide (SiC), gallium nitride (GaN),...
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Metal Powder Materials Used in 3D Printing

Crushing metals into fine particles produces metal powders used in 3D printing. Manufacturers can use powder for 3D printing operations and processes that produce metallic parts. It is also known as additive manufacturing and involves making new parts or products layer-by-layer. The kind of metal powder used and the 3D printing process applied determine the...
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What are Different Evaporation Sources for Thin-Film Deposition?

Thin-film deposition refers to the creation and deposition of thin-film coatings onto a substrate material. Thin-film deposition is applied in several manufacturing processes involving the production of solid-state, optoelectronic, and medical devices and products. It is also utilized to produce other essential materials, such as LED displays, semiconductor lasers, fiber lasers, optical filters, compound semiconductors,...
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What is Neodymium-doped Yttrium Aluminum Garnet

What is Neodymium-doped Yttrium Aluminum Garnet?

Neodymium-doped Yttrium Aluminum Garnet (Nd:YAG) can be described as a synthetic crystal used as a lasing medium in high-powered solid-state lasers. It consists of Neodymium, Aluminum, and Oxygen in the following proportion: Y3Al5O12. The dopant in the mix is triply-ionized neodymium, Nd(III). It replaces about 1% of the yttrium ions in the host yttrium aluminum...
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Is it Necessary to Add Bonding Service for Your Sputter Targets?

In the sputtering process, it is important to protect the sputter targets from damages, and a very good way to achieve this is by subjecting the sputter targets to bonding services. In this post, we’ll dive deeper into the meaning and importance of target bonding services, as well as the different types of target bonding...
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