Blogs

Introduction Gallium phosphide (GaP) is a compound semiconductor material that has gained increasing attention in the semiconductor industry. GaP wafers offer several advantages over traditional silicon wafers, including high efficiency, high-speed operation, and high power handling capabilities. In this article, we will talk about the benefits of using gallium phosphide wafers in electronic and optical...Continue Reading

Introduction Crucibles are widely used in metallurgy, chemical processing, and a variety of industries. Among these crucibles, graphite crucibles are useful for the smelting of non-ferrous metals and alloys with their desirable properties. Let’s have a detailed discussion about the features, competitiveness, and uses of graphite crucibles. Hope that you can have a better understanding...Continue Reading

Introduction to Indium Bonding Target bonding is a significant process that joins sputtering targets and backing plates together, yet improper bonding materials would lead to poor heat release, cracking, non-uniform deposition, and even de-bonding. Therefore, it is quite essential to have a basic understanding of the functions, benefits, and types of bonding in advance. This...Continue Reading

Introduction With the development of electronic devices, people pay more and more attention to wafers, chips, semiconductors, and integrated circuits. Everyone is trying to figure out the essence of chips. Their mind is full of questions. What is a wafer? What is a chip? What about their relations? What materials do we use to make...Continue Reading

Introduction Purity is one of the prime performance requirements of target selection, which has been explained in our previous article. It takes countless money, time, and labor every year to separate impurities. However, do impurities always have a negative influence on sputtering? We are going to explore this question in this article with specific cases....Continue Reading