Since tantalum has the ability to form oxides thin film, which has a protective effect, the tantalum target is widely used as a base material for electrolytic capacitor manufacturing. This article introduces the application of tantalum sputtering targets in the field of microelectronics. Tantalum for Thermal Inkjet Print Head Application Thermal inkjet print heads can be used...Continue Reading
When it comes to ITO, many people first think of the International Trade Organization. If you think this article is about the International Trade Organization, then I am sorry to tell you that maybe you can stop reading now, because ITO in this passage refers to indium tin oxide. Do you think these three words...Continue Reading
Common target shapes are rectangular planar targets and rotatory targets. From the name we can imagine what they look like, as shown below. The targets of these two shapes have their own advantages and disadvantages. For details, please refer to our previous news Advantages and Disadvantages of Planar target and Rotatory targets. Today, the focus...Continue Reading
In recent years, with the rapid development of coating technology, the demand for sputtering targets has increased rapidly. Then some people who are unfamiliar with sputtering targets may doubt: What are the applications of sputtering targets? The following is a detailed summary by SAM Sputter Targets. Decorative coating Decorative coating mainly refers to the...Continue Reading
Preparation It is very important to keep the vacuum chamber clean. Some residues formed during use will collect moisture and other pollutants, directly affecting the success rate of vacuum coating. Short-circuit or target arcing, film-forming surface roughness, and chemical impurities are often exceeded due to unclean sputtering chambers, sputter guns, and targets. In order to...Continue Reading
1. Preparation of Cu/In film by magnetron sputtering In order to accurately control the element ratio of Cu/In, CuIn film is prepared by the co-sputtering method. That is, the Cu/In alloy target and the In elemental target are simultaneously sputtered in the same sputtering chamber. The distribution of Cu/In content has a great influence on...Continue Reading
Sputter deposition rate is a parameter that characterizes the film formation rate. In addition to the influencing factors such as the type and pressure of the working gas, target type and area size of the “sputter etched area”, and target surface temperature and target surface magnetic field strength, the deposition rate is also directly affected...Continue Reading
Common targets and corresponding color 1. Golden Color Series Ti series: Ti TiN Ti+Au TiN+Au Ti+Zr TiZrN Other: Zr ZrN Zr+Au ZrN+Au Hf HfN 2.Black Color Series Ti series: Ti TiCN Ti (C, O) TiAl TiAlN Ti50Al50 black Ti30Al70 dark TiAl (C, O, N) Other: Si ...Continue Reading
As is known to all, purity is one of the main performance indexes of sputtering target materials, and the purity requirements of target materials are different in practical application. Compared with the general industrial pure titanium, the high-purity titanium target is expensive and has a narrow application range, which is mainly used to meet the...Continue Reading
