The sputtering target materials commonly found on the market can be divided into planar targets and rotatory targets according to their shapes. Want to know what are their advantages and disadvantages? Keep on reading this post. Planar Sputtering Target Although rotary targets have developed in recent years, the mainstream shape of the sputtering target is still the planar type. Advantages...Continue Reading

Titanium can be alloyed with iron, aluminum, vanadium, and molybdenum to produce strong, lightweight alloys for aerospace (jet engines, missiles, and spacecraft), military, industrial processes (chemicals and petrochemicals, desalination plants, pulp, and paper), automotive, marine, human implants, and other applications. In addition to low density and high specific strength, another important advantage of titanium alloy...Continue Reading

Electron Beam Evaporation – Definition Electron beam evaporation, or E-beam evaporation, is a type of physical vapor deposition (PVD) technique, which directly heats the evaporation material (usually pellets) by using an electron beam under vacuum, and transports the vaporized material to the substrate to form a film. Electron Beam Evaporation – Working Processes Electron beam evaporation...Continue Reading

Anelva target, I believe, is a very unfamiliar phrase for most people. And maybe that’s the reason why you are here, reading this article. Actually, with a simple explanation–Anelva target is also known as the target used in the semiconductor industry, you will immediately get its meaning. In today’s semiconductor manufacturing processes, sputtering targets are...Continue Reading

We have previously made a brief introduction of Five Sputter Coating Technologies, including unbalanced magnetron sputtering, radio frequency sputtering (RF sputtering), direct current magnetron sputtering (DC sputtering), mid-frequency alternating current magnetron sputtering (AC sputtering), and reactive magnetron sputtering. In this article, we are going to talk about direct current (DC) sputtering in detail. To begin...Continue Reading

What is PVD Coating Technology? Physical Vapor Deposition (PVD) is a thin film preparation technique that physically vaporizes the surface of a material source (solid or liquid) into gaseous atoms, molecules, or partially ionized into ions under vacuum conditions. Then, a film having a specific function is deposited on the surface of the substrate by...Continue Reading

Metal titanium and titanium sputtering target are essentially the same, both of which are composed of titanium element; the difference is that metal titanium is more like a raw material, and titanium target is more like a titanium product. Titanium as a raw material can be made into titanium sputtering targets by several methods, and...Continue Reading

Unbalanced magnetron sputtering Unbalanced magnetron sputtering uses an unbalanced magnetron sputtering cathode, which refers to the unequal magnetic fluxes of the inner and outer magnetic pole sections of the cathode. The effect of the unbalanced magnetic field is to trap fast-moving secondary electrons that escape from the target surface. These electrons undergo ionizing collisions with...Continue Reading

Ion Beam Sputtering Definition Ion beam sputtering (IBS), or ion beam deposition (IBD), is a thin film deposition technology that uses an ion source to deposit a sputtering target onto a substrate to produce the highest quality films with excellent precision. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control...Continue Reading