Chemical Formula: AlCuSi
Catalog Number: ST0483
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
The aluminum silicon copper sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers high-quality sputtering targets at the most competitive prices.
Aluminum, or Aluminium, is a silvery-white, soft, non-magnetic, and ductile metal in the boron group. By mass, aluminum makes up about 8% of the Earth’s crust; it is the third most abundant element after oxygen and silicon and the most abundant metal in the crust, though it is less common in the mantle below. The chief ore of aluminum is bauxite. Aluminum metal is highly reactive, such that native specimens are rare and limited to extreme reducing environments. Instead, it is found combined in over 270 different minerals.
Copper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.
Silicon is a chemical element that originated from the Latin ‘silex’ or ‘silicis’, meaning flint. It was first mentioned in 1824 and observed by J. Berzelius. The isolation was later accomplished and announced by J. Berzelius. “Si” is the canonical chemical symbol of silicon. Its atomic number in the periodic table of elements is 14 with location at Period 3 and Group 14, belonging to the p-block. The relative atomic mass of silicon is 28.0855(3) Dalton, the number in the brackets indicating the uncertainty.
Related Products: Aluminum sputtering target, Copper sputtering target.
Material Type | Aluminum Silicon Copper |
Symbol | Al, Si, Cu |
Available Sizes | Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ Thick: 0.125″, 0.250″ |
We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.
Aluminum Silicon Copper Sputtering Target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.
Our Aluminum Silicon Copper Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
SAM’s Aluminum Silicon Copper Sputter Targets are available in various forms, purities, sizes, and prices. We specialize in producing high-purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) display and optical applications.
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Very good product and exactly what I expected.