(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0494 Copper Tin Sputtering Target, Cu/Sn

Chemical Formula: CuSn
Catalog Number: ST0494
CAS Number: 158113-12-3
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

At SAM, we provide a range of Copper Tin Sputter Targets in different forms, purities, sizes, and prices. Our expertise lies in producing high-purity physical vapor deposition materials, optimized for use in semiconductor, chemical vapor deposition, and physical vapor deposition applications in displays and optics. If you require further information or have specific inquiries, feel free to contact us.




Description

Copper Tin Sputtering Target Description

CopperCopper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.

Tin

Tin, also called stannum, is a chemical element originated from the Anglo-Saxon word tin (stannum in Latin, meaning hard). It was early used in 3500 BC. “Sn” is the canonical chemical symbol of tin. Its atomic number in the periodic table of elements is 50 with location at Period 5 and Group 14, belonging to the p-block. The relative atomic mass of tin is 118.710(7) Dalton, the number in the brackets indicating the uncertainty.

Related Products: Copper Sputtering TargetTin Sputtering TargetAlloy Sputtering Target

Copper Tin Sputtering Target Specifications

Material Type Copper Tin
Symbol Cu/Sn
Color/Appearance Metallic solid in various forms including powder, sputtering target, foil, bar, plate
Melting Point /
Density /
Available Sizes Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.

Copper Tin Sputtering Target Application

Copper Tin Sputtering Target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.

Packing

Our Copper Tin Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Submit your review
1
2
3
4
5
Submit
     
Cancel

Create your own review

Copper Tin Sputtering Target, Cu/Sn
Average rating:  
 1 reviews
by Marine Froment on Copper Tin Sputtering Target, Cu/Sn

Great sputtering materials for any lab. Great quality, amazing price.

I love all of my coating stuff from SAM.