(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0089 Copper Nickel Sputtering Target, Cu/Ni

Chemical Formula: Cu/Ni
Catalog Number: ST0089
CAS Number: 7440-50-8 | 7440
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

The copper nickel sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers high-quality copper nickel sputter targets at the most competitive prices.




Description

Copper Nickel Sputtering Target Description

The copper nickel sputtering target from Stanford Advanced Materials is an alloy sputtering material containing Cu and Ni.

CopperCopper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with a location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Copper Sputtering Target

NickelNickel is a chemical element that originated from the shortened of the German ‘kupfernickel’ meaning either devil’s copper or St. Nicholas’s copper. It was first mentioned in 1751 and observed by F. Cronstedt. The isolation was later accomplished and announced by F. Cronstedt. “Ni” is the canonical chemical symbol of nickel. Its atomic number in the periodic table of elements is 28 with a location at Period 4 and Group 10, belonging to the d-block. The relative atomic mass of nickel is 58.6934(2) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Nickel Sputtering Target

Copper Nickel Sputtering Target Specification

Compound Formula CuNi
Molecular Weight 122.239 g/mol
Appearance Metallic solid in various forms (plate, bar, sheet, strip, powder, foil)
Melting Point 1110~1235 ℃
Density 8.5-8.95 g/cm3
Electrical Resistivity 3.8 x 10-8 Ω·m

Copper Nickel Sputtering Target Application

The copper nickel sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.

Copper Nickel Sputtering Target Packing

Our copper nickel sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Get Contact

High-quality copper nickel sputtering target is available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film coating materials with the highest possible density and smallest possible average grain sizes. Please send us an inquiry for the current prices of the sputtering targets and other deposition materials that are not listed.

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Copper Nickel Sputtering Target, Cu/Ni
Average rating:  
 1 reviews
by Jose Guzman on Copper Nickel Sputtering Target, Cu/Ni

These work great. I've only used them to sputter a thin film. They are a great price too.