Chemical Formula: Cu/Co
Catalog Number: ST0085
CAS Number: 7440-50-8 | 7440
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
The copper cobalt sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers high-quality copper cobalt sputter targets at the most competitive prices.
Copper cobalt sputtering target from Stanford Advanced Materials is an alloy sputtering material containing Cu and Co.
Copper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with a location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Copper Sputtering Target
Cobalt is a chemical element that originated from the German word ‘kobald’, meaning goblin. It was first mentioned in 1732 and observed by G. Brandt. “Co” is the canonical chemical symbol of cobalt. Its atomic number in the periodic table of elements is 27 with a location at Period 4 and Group 9, belonging to the d-block. The relative atomic mass of cobalt is 58.933195(5) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Cobalt Sputtering Target
Our copper cobalt sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
High-quality copper cobalt sputtering target is available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film coating materials with the highest possible density and smallest possible average grain sizes. Please send us an inquiry for the current prices of the sputtering targets and other deposition materials that are not listed.
