(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0298 Nickel Boride Sputtering Target, Ni2B

Chemical Formula: Ni2B
Catalog Number: ST0298
CAS Number: 12007-01-1
Purity: >99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

The nickel boride sputtering target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) offers high-quality nickel boride sputter targets at the most competitive prices.

Nickel Boride MSDS File




Description

Nickel Boride Sputtering Target Description

Nickel boride sputtering target is a type of boride ceramic sputtering target composed of nickel and boron.

NickelNickel is a chemical element originated from the shortened of the German ‘kupfernickel’ meaning either devil’s copper or St. Nicholas’s copper. It was first mentioned in 1751 and observed by F. Cronstedt. The isolation was later accomplished and announced by F. Cronstedt. “Ni” is the canonical chemical symbol of nickel. Its atomic number in the periodic table of elements is 28 with location at Period 4 and Group 10, belonging to the d-block. The relative atomic mass of nickel is 58.6934(2) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Nickel Sputtering Target

BoronBoron is a chemical element originated from the Arabic ‘buraq’, which was the name for borax. It was first mentioned in 1808 and observed by L. Gay-Lussac and L.J. Thénard. The isolation was later accomplished and announced by H. Davy. “B” is the canonical chemical symbol of boron. Its atomic number in the periodic table of elements is 5 with location at Period 2 and Group 13, belonging to the p-block. The relative atomic mass of boron is 10.811(7) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Boride Ceramic Sputtering Target

Nickel Boride Sputtering Target Specification

Compound Formula Ni2B
Appearance Solid
Density 7.9 g/cm3
Melting Point N/A
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Nickel Boride Sputtering Target Application

The nickel boride sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.

Nickel Boride Sputtering Target Packing

Our nickel boride sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Get Contact

SAM’s nickel boride Ni2B sputtering targets are available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film coating materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Please send us an inquiry for the current prices of sputtering targets and other deposition materials that are not listed.

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Nickel Boride Sputtering Target, Ni2B
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